Ni electroless plating process for solder bump chip on glass technology

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 36, Issue 4 A, 1997, Pages 2091-2095

  Han, Jeong In ^a   Hong, Sung Jei ^a  

^a Korea Electronic Technology Institute (KETI)   (South Korea)

Author keywords

Bare chip; COG; LCD; Ni electroless plating; Solder bump; Zincation

Indexed keywords

CHIP ON GLASS TECHNOLOGY; SOLDER BUMP;

ALUMINUM; LIQUID CRYSTAL DISPLAYS; NICKEL PLATING; PHOTORESISTS; SEMICONDUCTING GLASS; SOLUTIONS; SUBSTRATES; THIN FILMS;

ELECTROLESS PLATING;

EID: 0031121497     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.36.2091     Document Type: Article

References (13)

1. J. I. Man and C. S. Kim: Telecommun. Rev. IV 4 (1994) No. 3, 24.
2. Y. Chaikawa, K. Mori and N. Taimara: ISHM '93 Proc. (1993) p. 343.
3. D. W. Palmer and G. K. Lin: ISHM '93 Proc. (1993) p. 238.
4. C. Massit, G. Nicolas, B. Hepp and J. M. Vignolle: SID '93 Application Dig. (1993) p, 69.
5. M. Fuyama, F. Nakano, T. Soga, M. Morijiri, M. Funyuu and I. Nunokawa: Vacuum 30 (1987) 555.
6. M. Saito, M. Mori and H. Saita: Toshiba Rev. 45 (1990) 435.
7. T. Tamura, I. Kobayashi, M. Uno, K. Adachi, M. Takeda, S. Hotta, Y. Bessho and S. Nakamura: Proc. SID 32 (1991) 289.
8. S. Heimen: J. Electrochem. Soc. 95 (1949) 205.
9. A. Brenner and G. E. Riddle: U.S. Patent 2,532,284.
10. M. E. Straumanis and N. J. Brakss: J. Electrochem. Soc. 95 (1949) 98.
11. M. A. Streicher: J. Electrochem. Soc. 83 (1948) 285.
12. J. V. Petrocelli: J. Electrochem. Soc. 97 (1950) 10.
13. D. W. Lee: Doctoral thesis, Metall. Dept., Seoul National Univ., Seoul, Korea, 1985.