Technological and material related challenges for large area, high aspect-ratio, near teradot/Inch2 areal density and three-dimensional structuring of polyaniline

Journal of Nanoscience and Nanotechnology

Volumn 11, Issue 10, 2011, Pages 8924-8935

  Jedrasik, Piotr ^a   Vlad, Alexandru ^b   Södervall, Ulf ^a  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b UNIVERSITÉ CATHOLIQUE DE LOUVAIN   (Belgium)

Author keywords

3D e Beam Lithography; Key Lock Self Assembly; Near Teradot Sqinch; Polyaniline; Surface Confined Polymerization

Indexed keywords

3D TEMPLATES; ANILINE POLYMERIZATION; AREAL DENSITIES; BEAM INTERACTIONS; CONDUCTING POLYANILINE; E-BEAM LITHOGRAPHY; FUNCTIONALIZATIONS; GENERIC APPROACH; GROWTH MECHANISMS; HIGH ASPECT RATIO; HIGH-RESOLUTION ELECTRON BEAM LITHOGRAPHY; INTRINSIC PROPERTY; KEY-LOCK SELF-ASSEMBLY; NANO SCALE; NANOPATTERNING; NANOSCALE PROCESSING; NEAR TERADOT/SQINCH; OPTOELECTRONIC TECHNOLOGY; PATTERN TRANSFERS; PHYSICO-CHEMICALS; POLYMERIZATION REACTORS; RIGID SUBSTRATES; SURFACE-INITIATED;

ASPECT RATIO; ELECTRON BEAM LITHOGRAPHY; FUNCTIONAL POLYMERS; NANOTECHNOLOGY; PLATINUM; POLYMERIZATION; SURFACES; THREE DIMENSIONAL;

POLYANILINE;

EID: 84857156448     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2011.3475     Document Type: Conference Paper

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