Synthesis and properties of two novel silicon-containing cycloaliphatic epoxy resins for electronic packaging application

Polymers for Advanced Technologies

Volumn 23, Issue 3, 2012, Pages 367-374

  Liu, Wanshuang ^a   Wang, Zhonggang ^a   Chen, Zhuo ^a   Li, Jianfeng ^a   Zhao, Linni ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Electronic packaging; Epoxy resins; Silicon; Synthesis; Viscosity

Indexed keywords

CROSS-LINKING DENSITY; CYCLOALIPHATIC; CYCLOALIPHATIC EPOXY RESINS; DIFUNCTIONAL; ELECTRONIC PACKAGING; EPOXY GROUP; FLOWABILITY; FTIR; INFRARED SPECTRUM; MICROELECTRONIC PACKAGING; NUCLEOPHILIC SUBSTITUTION REACTIONS;

CURING; ELECTRONICS PACKAGING; EPOXY RESINS; GLASS TRANSITION; MECHANICAL PROPERTIES; METHANOL; MICROELECTRONICS; OLEFINS; SILICON; SILICON COMPOUNDS; SUBSTITUTION REACTIONS; SYNTHESIS (CHEMICAL); THERMODYNAMIC STABILITY; VISCOSITY;

RESINS;

EID: 84856689430     PISSN: 10427147     EISSN: 10991581     Source Type: Journal    
DOI: 10.1002/pat.1882     Document Type: Article

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