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Volumn 515, Issue , 2012, Pages 4-7
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4-nm thick multilayer structure of multi-component (AlCrRuTaTiZr)N x as robust diffusion barrier for Cu interconnects
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Author keywords
Diffusion barrier; Multi component; Multilayer
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Indexed keywords
ALUMINUM ALLOYS;
CHROMIUM ALLOYS;
COPPER;
INTEGRATED CIRCUIT INTERCONNECTS;
MULTILAYERS;
RUTHENIUM ALLOYS;
SILICIDES;
TANTALUM ALLOYS;
TITANIUM ALLOYS;
ZIRCONIUM ALLOYS;
AMORPHOUS SOLID SOLUTIONS;
DIFFUSION BARRIER LAYERS;
LATTICE DISTORTIONS;
MULTICOMPONENTS;
MULTILAYER STACKING;
MULTILAYER STRUCTURES;
MULTIPLE COMPONENTS;
THICK MULTILAYERS;
DIFFUSION BARRIERS;
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EID: 84855419780
PISSN: 09258388
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jallcom.2011.11.082 Document Type: Letter |
Times cited : (87)
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References (22)
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