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Volumn 515, Issue , 2012, Pages 4-7

4-nm thick multilayer structure of multi-component (AlCrRuTaTiZr)N x as robust diffusion barrier for Cu interconnects

Author keywords

Diffusion barrier; Multi component; Multilayer

Indexed keywords

ALUMINUM ALLOYS; CHROMIUM ALLOYS; COPPER; INTEGRATED CIRCUIT INTERCONNECTS; MULTILAYERS; RUTHENIUM ALLOYS; SILICIDES; TANTALUM ALLOYS; TITANIUM ALLOYS; ZIRCONIUM ALLOYS;

EID: 84855419780     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2011.11.082     Document Type: Letter
Times cited : (87)

References (22)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.