A new grounding scheme to reduce the electromagnetic emission of smart-power system-on-chips

IEEE Transactions on Power Electronics

Volumn 27, Issue 1, 2012, Pages 224-234

  Fiori, Franco ^a   Merlin, Marco ^b  

^a POLITECNICO DI TORINO   (Italy)

^b ISTITUTO SUPERIORE MARIO BOELLA   (Italy)

Author keywords

Application specific ICs (ASICs); Electromagnetic compatibility (EMC); Electromagnetic emission; Front end ICs; Smart power; Substrate coupling; Switching noise; System on chip (SoC)

Indexed keywords

APPLICATION-SPECIFIC ICS (ASICS); ELECTROMAGNETIC EMISSIONS; FRONT END; SMART POWER; SUBSTRATE COUPLING; SWITCHING NOISE; SYSTEM-ON-CHIP;

CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; ELECTROMAGNETIC COMPATIBILITY; ELECTROMAGNETIC DISPERSION; ELECTROMAGNETIC WAVE EMISSION; ELECTROMAGNETISM; INTEGRATED CONTROL; MICROPROCESSOR CHIPS; POWER TRANSMISSION; PRINTED CIRCUIT BOARDS; PROGRAMMABLE LOGIC CONTROLLERS; SUBSTRATES; SWITCHING;

APPLICATION SPECIFIC INTEGRATED CIRCUITS;

EID: 83655192798     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2010.2068312     Document Type: Article

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