Self-driven electronic cooling based on thermosyphon effect of room temperature liquid metal

Journal of Electronic Packaging

Volumn 133, Issue 4, 2011, Pages

  Li, Peipei ^a   Liu, Jing ^a,b  

^a TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY   (China)

^b TSINGHUA UNIVERSITY   (China)

Author keywords

chip cooling; heat driven; heat transfer enhancement; LED; liquid metal; self support; thermal management; thermosyphon effect

Indexed keywords

CAPILLARY FLOW; COOLANTS; ENERGY UTILIZATION; HEAT CONVECTION; HEAT PIPES; HEAT RESISTANCE; HEAT TRANSFER COEFFICIENTS; LIGHT EMITTING DIODES; LIQUID METALS; METALS; SIPHONS; TEMPERATURE DISTRIBUTION; THERMAL MANAGEMENT (ELECTRONICS); THERMOCOUPLES; THERMOSYPHONS; UNCERTAINTY ANALYSIS;

CHIP COOLING; COOLING PERFORMANCE; CRITICAL ISSUES; ELECTRONICS COOLING; HEAT TRANSFER ENHANCEMENT; HEAT-DRIVEN; LIGHTEMITTING DIODE; SELF SUPPORT; SELF-DRIVEN; THERMOSIPHON EFFECT;

TEMPERATURE CONTROL;

EID: 83455186861     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4005297     Document Type: Article

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