Nano liquid-metal fluid as ultimate coolant

Physics Letters, Section A: General, Atomic and Solid State Physics

Volumn 361, Issue 3, 2007, Pages 252-256

  Ma, Kun Quan ^a   Liu, Jing ^a  

^a TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY   (China)

Author keywords

Base fluid; Chip cooling; Heat transfer enhancement; Liquid metal; Nano fluid; Nano liquid metal flow; Thermal management; Ultimate coolant

Indexed keywords

COOLANTS; HEAT TRANSFER COEFFICIENTS; LIQUID METALS; NANOPARTICLES; PARTICLE SIZE; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY; THERMAL MANAGEMENT (ELECTRONICS);

CHIP COOLING; CONDUCTIVE SOLUTIONS; HEAT TRANSFER ENHANCEMENT; LIQUID METAL FLOWS; LOW MELTING POINT; NANOFLUIDS; THERMAL CONDUCTIVITY ENHANCEMENT;

METALS;

EID: 33845212677     PISSN: 03759601     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.physleta.2006.09.041     Document Type: Article

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