Heat-driven liquid metal cooling device for the thermal management of a computer chip

Journal of Physics D: Applied Physics

Volumn 40, Issue 15, 2007, Pages 4722-4729

  Ma, Kun Quan ^a   Liu, Jing ^a  

^a TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; LIQUID METALS; MICROPROCESSOR CHIPS; TEMPERATURE CONTROL; THERMAL EFFECTS; THERMOELECTRICITY;

COMPUTER CHIPS; LIQUID METAL COOLING DEVICES; LIQUID-COOLING CONCEPT; THERMOELECTRIC GENERATOR (TEG);

COOLING SYSTEMS;

EID: 34547425294     PISSN: 00223727     EISSN: 13616463     Source Type: Journal    
DOI: 10.1088/0022-3727/40/15/055     Document Type: Article

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