Study of thawing behavior of liquid metal used as computer chip coolant

International Journal of Thermal Sciences

Volumn 48, Issue 5, 2009, Pages 964-974

  Ma, Kun Quan ^a   Liu, Jing ^a   Xiang, Shi Hai ^a   Xie, Kai Wang ^a   Zhou, Yi Xin ^a  

^a TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY   (China)

Author keywords

Chip cooling; Frozen liquid; Green's function; Liquid metal coolant; Low melting metal or alloy; Moving heat source; Phase change heat transfer; Thawing; Thermal management

Indexed keywords

COOLANTS; COOLING; DIFFERENTIAL EQUATIONS; GREEN'S FUNCTION; HEAT EXCHANGERS; INTEGRATED CIRCUITS; LIQUID METALS; METALS; SMELTING; TEMPERATURE CONTROL; THAWING;

CHIP COOLING; FROZEN LIQUID; LIQUID METAL COOLANT; LOW-MELTING METAL OR ALLOY; MOVING HEAT SOURCE; PHASE CHANGE HEAT TRANSFER; THERMAL MANAGEMENT;

METAL MELTING;

EID: 60549114693     PISSN: 12900729     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijthermalsci.2008.08.005     Document Type: Article

References (19)

1. J. Liu, Y.X. Zhou, A computer chip cooling method which uses low melting point metal and its alloys as the cooling fluid, China Patent: 02131419.5, 2002
2. Miner A., and Ghoshal U. Cooling of high-power-density microdevices using liquid metal coolants. Appl. Phys. Lett. 85 (2004) 506
3. Silverman I., Yarin A.L., Reznik S.N., Arenshtam A., Kijet D., and Nagler A. High heat-flux accelerator targets: Cooling with liquid metal jet impingement. Int. J. Heat Mass Trans. 49 (2006) 2782-2792
4. Andreev O., Kolesnikov Y., and Thess A. Experimental study of liquid metal channel flow under the influence of a nonuniform magnetic field. Phys. Fluids 18 (2006) 065108
5. Mohseni K., and Baird E.S. Digitized heat transfer using electrowetting on dielectric. Nanoscale and Microscale Thermophysical Engineering 11 (2007) 99-108
6. Baird E.S., and Mohseni K. Digitized heat transfer: A new paradigm for thermal management of compact micro systems. IEEE Transactions on Components and Packaging Technologies 31 (2008) 143-151
7. Ma K.Q., and Liu J. Heat-driven liquid metal cooling device for the thermal management of computer chip. J. Phys. D: Appl. Phys. 40 (2007) 4722-4729
8. Singhal V., and Garimella S.V. Induction electrohydrodynamics micropump for high heat flux cooling. Sensor Actuat. A Phys. 134 (2007) 650-659
9. K. Mohseni, Effective cooling of integrated circuits using liquid alloy electrowetting, in: 21st IEEE SEMI-THERM Symposium, 2005
10. Cooney C.G., Chen C.Y., Emerling M.R., Nadim A., and Sterling J.D. Electrowetting droplet microfluidics on a single planar surface. Microfluid Nanofluid 2 (2006) 435-446
11. Li T., Lv Y.G., Liu J., and Zhou Y.X. A powerful way of cooling computer chip using liquid metal with low melting point as the cooling fluid. Forsch Ingenieurwes 70 (2005) 243-251
12. Ma K.Q., and Liu J. Nano liquid-metal fluid as ultimate coolant. Phys. Lett. A 361 (2007) 252-256
13. Gao Y.L., Guan W.B., Zhai Q.J., and Xu K.D. Study on undercooling of metal droplet in rapid solidification. Sci. China Ser. E 48 (2005) 632-637
14. Ma K.Q., and Liu J. Liquid metal cooling in thermal management of computer chip. Front. Energy Power Eng. China 1 (2007) 384-402
15. Ozisik M.N. Heat Conduction. second ed. (1993), Wiley
16. Liu J., and Zhou Y.X. Analytical study on the freezing and thawing processes of biological skin with finite thickness. Heat Mass Trans. 38 (2002) 319-326
17. Yang C.Y. The determination of two moving heat sources in two-dimensional inverse heat problem. Appl. Math. Model. 30 (2006) 278-292
18. Ali Y.M., and Zhang L.C. Relativistic moving heat source. Int. J. Heat Mass Trans. 48 (2005) 2741-2758
19. Qian Z.Y. Thermophysical Properties of Low Melting Point Metal (1985), Science Press, Beijing