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Volumn 95, Issue 3, 2009, Pages 907-915
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Corrosion development between liquid gallium and four typical metal substrates used in chip cooling device
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Author keywords
[No Author keywords available]
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Indexed keywords
1CR18NI9 STAINLESS STEELS;
CHEMICAL COMPOSITIONS;
CHIP COOLING;
COMPUTER CHIPS;
COMPUTER INDUSTRIES;
CORRODED LAYERS;
CORROSION BEHAVIORS;
CORROSION MECHANISMS;
CORROSION MORPHOLOGIES;
CORROSION PHENOMENON;
CORROSION PROCESS;
CORROSION PRODUCTS;
CRITICAL ISSUES;
ENERGY DISPERSIVE SPECTROMETRIES;
EXCELLENT CORROSION RESISTANCES;
GENERAL CORROSIONS;
IN CHIPS;
LIQUID GALLIUMS;
LIQUID METAL COOLING;
LOW MELTING POINTS;
METAL CHIPS;
METAL COOLANTS;
METAL SUBSTRATES;
ROOM TEMPERATURES;
SCANNING ELECTRON MICROSCOPES;
SEM;
STRUCTURE MATERIALS;
TEMPERATURE RANGES;
THERMAL MANAGEMENTS;
THERMO-PHYSICAL PROPERTIES;
ALUMINA;
ALUMINUM;
COLORING;
COOLANTS;
COOLING;
CORROSION PREVENTION;
CORROSION RESISTANCE;
EXPLOSIVE ACTUATED DEVICES;
GALLIUM;
GALLIUM ALLOYS;
IMAGE ACQUISITION;
INTEGRATED CIRCUITS;
LIQUID METALS;
MELTING POINT;
METALS;
SCANNING ELECTRON MICROSCOPY;
SMELTING;
STAINLESS STEEL;
STEEL METALLURGY;
SUBSTRATES;
SURFACE TREATMENT;
METAL MELTING;
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EID: 63949086967
PISSN: 09478396
EISSN: 14320630
Source Type: Journal
DOI: 10.1007/s00339-009-5098-1 Document Type: Article |
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Times cited : (104)
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References (16)
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