Hybrid liquid metal-water cooling system for heat dissipation of high power density microdevices

Heat and Mass Transfer/Waerme- und Stoffuebertragung

Volumn 46, Issue 11-12, 2010, Pages 1327-1334

  Deng, Yueguang ^a   Liu, Jing ^a  

^a TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CONVECTIVE COEFFICIENT; COOLING CAPABILITY; COOLING PERFORMANCE; ECONOMIC FEASIBILITIES; ELECTRONIC INDUSTRIES; HEAT DISSIPATION; HEAT SPREADERS; HIGH COSTS; HIGH POWER DENSITY; INITIAL COSTS; LIQUID METAL COOLING; MICRO DEVICES; NEW SYSTEM; OPERATION CONDITIONS; POWER DENSITIES; SCALE UTILIZATION; THERMAL MANAGEMENT; THERMAL RESISTANCE; VERY LARGE SCALE INTEGRATED CIRCUIT; WATER COOLING;

COOLING SYSTEMS; HYBRID SYSTEMS; LIQUID METALS; METALS; PORTABLE EQUIPMENT; THERMOELECTRIC EQUIPMENT; VLSI CIRCUITS; WATER COOLING TOWERS; WATER DISTRIBUTION SYSTEMS;

COOLING;

EID: 78650607661     PISSN: 09477411     EISSN: 14321181     Source Type: Journal    
DOI: 10.1007/s00231-010-0658-7     Document Type: Article

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