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Transactions of the Institute of Metal Finishing

Volumn 89, Issue 6, 2011, Pages 303-309

Review of effect of ultrasound on electroless plating processes

(3) Cobley, A J a Mason, T J a Saez, V a

a Faculty of Engineering and Computing (United Kingdom)

Author keywords

Copper; Electroless; Nickel; Plating; Sonochemistry; Ultrasound

Indexed keywords

ACOUSTIC CAVITATIONS; DIFFUSION LAYERS; ELECTROCHEMICAL PROCESS; ELECTROLESS; ELECTROLESS DEPOSITION PROCESS; ELECTROLESS PLATING PROCESS; PHOTOVOLTAICS; PLATING RATES; SONOELECTROCHEMISTRY; ULTRASONIC FIELD; ULTRASONIC IRRADIATION;

ACOUSTIC FIELDS; ADHESION; COPPER; ELECTROCHEMISTRY; ELECTROLESS PLATING; NICKEL; PLATING; SONOCHEMISTRY;

ULTRASONICS;

EID: 82455205790 PISSN: 00202967 EISSN: 17459192 Source Type: Journal
DOI: 10.1179/174591911X13170500147670 Document Type: Review

Times cited : (38)

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