Electroless Copper Deposition in a Blind Via Hole of Printed Wiring Board. Uniform Copper Deposition by Axial Temperature Gradient

Electrochemistry

Volumn 68, Issue 7, 2000, Pages 568-571

  Matsushima, Toshifumi ^a   Habaki, Hiroaki ^a   Kawasaki, Junjiro ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Blind via hole; Electroless copper deposition; Printed wiring board; Uniform copper deposition

Indexed keywords

ASPECT RATIO; COMPUTER SIMULATION; COPPER PLATING; DIFFUSION; ELECTROLESS PLATING; ISOTHERMS; MATHEMATICAL MODELS; REDUCTION; THERMAL EFFECTS; THERMAL GRADIENTS; TRANSPORT PROPERTIES; VIBRATIONS (MECHANICAL);

ULTRASONIC VIBRATION;

PRINTED CIRCUIT BOARDS;

EID: 0034227278     PISSN: 13443542     EISSN: None     Source Type: Journal    
DOI: 10.5796/electrochemistry.68.568     Document Type: Article

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