Electroless copper plating on microcellular polyurethane foam

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 20, Issue SUPPL.1, 2010, Pages

  Tian, Qing Hua ^a   Guo, Xue Yi ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Deposition rate; Electroless copper plating; Foam metal material; Microcellular; Polyurethane foam

Indexed keywords

CONDUCTIVE MATERIALS; COPPER COMPOUNDS; COPPER PLATING; DEPOSITION RATES; IRON COMPOUNDS; METALS; MICROCELLULAR RADIO SYSTEMS; PH; POLYURETHANES; PORE SIZE; RIGID FOAMED PLASTICS; SODIUM COMPOUNDS; ULTRASONIC APPLICATIONS;

ELECTROLESS COPPER PLATING; FOAM METALS; MICROCELLULAR; OPTIMUM PROCESS CONDITIONS; POLYURETHANE FOAM; SOLUTION COMPOSITION; TECHNICAL CONDITIONS; THREE DIMENSIONAL NETWORK STRUCTURE;

METAL FOAMS;

EID: 78649676852     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1003-6326(10)60057-X     Document Type: Article

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