Plating of small blind vias

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 22, Issue 3, 1999, Pages 202-208

  Kou, Show Chin ^a   Hung, Aina ^a  

^a TA HWA INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COPPER PLATING; DIELECTRIC MATERIALS; ELECTRIC CURRENTS; ELECTROLESS PLATING; INTEGRATED CIRCUIT LAYOUT; LAMINATES; LASER ABLATION; LASER PULSES; METALLIZING; MICROSCOPIC EXAMINATION;

PULSE REVERSAL PLATING; SMALL BLIND VIAS; SUBSEQUENT COPPER ELECTROPLATING;

ELECTRONICS PACKAGING;

EID: 0033338110     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.795855     Document Type: Article

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30. Unpublished results: Vertical cross sections of the vias with combinations of three different epoxy thickness (75, 150, and 225 μm) and nine different diameters (from 75-275 μm with a 25 μm interval) processed by all four methods (Table I) were investigated (3 × 9 × 4= 108 total samples).