Managing losses in through silicon vias with different return current path configurations

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 206-211

  Curran, Brian ^a   Ndip, Ivan ^a   Guttovski, Stephan ^a   Reichl, Herbert ^a,b  

^a FRAUNHOFER IZM   (Germany)

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CELLULAR RADIO SYSTEMS;

ATTENUATION ,; BULK CONDUCTIVITIES; FULL-WAVE SIMULATIONS; INTERCONNECT SCHEMES; RETURN CURRENT PATHS; SILICON-BASED; SYSTEM IN PACKAGES; THROUGH SILICON VIAS;

ELECTRONICS PACKAGING;

EID: 63049119699     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763435     Document Type: Conference Paper

References (8)

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