The evolution of water cooling for IBM large server systems: Back to the future

2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Volumn , Issue , 2008, Pages 266-274

  Ellsworth Jr , M J ^a   Campbell, L A ^a   Simons, R E ^a   Iyengar, M K ^a   Schmidt, R R ^a   Chu, R C ^a  

^a IBM   (United States)

Author keywords

Cold plate; Coolant distribution unit; Liquid cooling; Modular water cooling unit; Rear door heat exchanger; Server; Supercomputer

Indexed keywords

COMPUTER NETWORKS; COMPUTER SYSTEMS; COOLING; COOLING SYSTEMS; EFFICIENCY; ELECTRONICS ENGINEERING; ENERGY EFFICIENCY; FIGHTER AIRCRAFT; FORMING; THERMAL LOAD; THERMOELECTRIC EQUIPMENT; THERMOMECHANICAL TREATMENT;

COLD PLATE; COOLANT DISTRIBUTION UNIT; LIQUID COOLING; MODULAR WATER COOLING UNIT; REAR DOOR HEAT EXCHANGER; SERVER; SUPERCOMPUTER;

WATER COOLING SYSTEMS;

EID: 50949086198     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2008.4544279     Document Type: Conference Paper

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