Formation of primary intermetallic compounds in Sn-Ag-Cu Alloys

Materials Science Forum

Volumn 654-656, Issue , 2010, Pages 1397-1399

  Takamatsu, Yoshiko ^a   Esaka, Hisao ^a   Shinozuka, Kei ^a  

^a NATIONAL DEFENSE ACADEMY   (Japan)

Author keywords

Intermetallic compound; Lead free solder; Nucleation; Primary phase; Sn Ag Cu alloy; Undercooling

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; EUTECTICS; INTERMETALLICS; LEAD-FREE SOLDERS; LIQUIDS; NUCLEATION; SILVER ALLOYS; SOLIDIFICATION; TERNARY ALLOYS; UNDERCOOLING;

BINARY EUTECTICS; EQUILIBRIUM PHASE DIAGRAMS; PRIMARY PHASE; SN-AG-CU ALLOY; SOLIDIFICATION PATHS; SOLIDIFICATION PROCESS; TERNARY EUTECTICS; THERMODYNAMIC CALCULATIONS;

TIN ALLOYS;

EID: 77955478548     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/MSF.654-656.1397     Document Type: Conference Paper

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