Fracture toughness of bonds using interfacial stresses in four-point bending test

Mechanics of Materials

Volumn 43, Issue 12, 2011, Pages 885-900

  Abdelhadi, Ousama M ^a   Ladani, Leila ^a   Razmi, Jafar ^b  

^a University of Alabama   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

Four point bending; Fracture toughness; Interfacial shear and peeling stresses; Stress intensity factor

Indexed keywords

3-DIMENSIONAL; ALTERNATIVE APPROACH; ANALYTICAL APPROACH; ANALYTICAL MODELING; ANALYTICAL SOLUTIONS; BEAM THEORIES; BOND CHARACTERISTICS; BOND MATERIALS; CONVENTIONAL TECHNIQUES; ELASTIC REGION; ENERGY EQUILIBRIUM; FOUR-POINT BEND SPECIMEN; FOUR-POINT BENDING; FOUR-POINT BENDING TEST; FOURTH-ORDER DIFFERENTIAL EQUATIONS; FRACTURE TOUGHNESS MEASUREMENTS; GOVERNING DIFFERENTIAL EQUATIONS; INTERFACIAL SHEAR; INTERFACIAL STRESS; INTERMETALLIC MATERIALS; MICRO-ELECTRONIC DEVICES; MOMENT DIAGRAMS; NOTCHED SPECIMENS; PEELING STRESS; PHOTONIC PACKAGING; SHEAR FORCE; SMALL SCALE; SMALL STRAINS; STANDARD METHOD; STRESS INTENSITY; TWO LAYERS;

ANALOG DIFFERENTIAL ANALYZERS; BOUNDARY CONDITIONS; CRACK PROPAGATION; ELASTICITY; EXPERIMENTS; FIBER OPTIC SENSORS; FRACTURE; INTERFACES (MATERIALS); MICROELECTRONICS; SHEAR STRESS; STRENGTH OF MATERIALS; WAFER BONDING;

FRACTURE TOUGHNESS;

EID: 80155214041     PISSN: 01676636     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mechmat.2011.09.006     Document Type: Article

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