Modeling and testing of the collective effects of thermoelastic and fluid damping on silicon MEMS resonators

Journal of Micro/Nanolithography, MEMS, and MOEMS

Volumn 8, Issue 2, 2009, Pages

  Yi, Yun Bo ^a   Rahafrooz, Amir ^a   Pourkamali, Siavash ^a  

^a University of Denver   (United States)

Author keywords

Sensors; Simulations; Vibration analysis

Indexed keywords

COMPUTER SIMULATION; EIGENVALUES AND EIGENFUNCTIONS; EXPERIMENTS; FINITE ELEMENT METHOD; FLUIDS; MICROELECTROMECHANICAL DEVICES; NATURAL FREQUENCIES; PERTURBATION TECHNIQUES; QUALITY CONTROL; RESONATORS; THERMOELASTICITY; VIBRATION ANALYSIS;

BEAM RESONATORS; COLLECTIVE EFFECTS; COMPUTATIONAL PREDICTIONS; EIGENVALUE EQUATIONS; EXPERIMENTAL CORRELATION; FINITE ELEMENT MODELS; FLUID DAMPING; GOVERNING EQUATIONS; IN-PLANE VIBRATION; LINEAR DAMPING; OUT-OF-PLANE; PERTURBATION METHOD; QUALITY FACTORS; RESONANT BEHAVIOR; SILICON MEMS; SILICON RESONATORS; SIMULATIONS; THERMOELASTIC DAMPING; THERMOELASTICS;

DAMPING;

EID: 80055050431     PISSN: 19325150     EISSN: 19325134     Source Type: Journal    
DOI: 10.1117/1.3129830     Document Type: Article

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