Electrodeposition of microstructures using a patterned anode

Electrochemistry Communications

Volumn 13, Issue 11, 2011, Pages 1229-1232

  Wu, Qi Bai ^a   Green, T A ^a   Roy, S ^a  

^a NEWCASTLE UNIVERSITY   (United Kingdom)

Author keywords

Copper; Electrodeposition; Etching; Microfabrication

Indexed keywords

CLOSE PROXIMITY; CONDUCTIVE SUBSTRATES; COPPER LINES; CURRENT SPREADING; ELECTROCHEMICAL PARAMETERS; ELECTROCHEMICAL REACTOR; INTERELECTRODE GAPS; LOW CONDUCTIVITY; MICRO-SCALES; MULTIPLE SUBSTRATES; PHOTORESIST MASK;

COPPER; ELECTRIC REACTORS; PHOTORESISTS; SUBSTRATES;

ELECTRODEPOSITION;

EID: 80054972482     PISSN: 13882481     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.elecom.2011.08.037     Document Type: Article

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