Metal printing of copper interconnects down to 500 nm using ECPR - Electrochemical pattern replication

Microelectronic Engineering

Volumn 83, Issue 4-9 SPEC. ISS., 2006, Pages 1410-1413

  Moller P ^a   Fredenberg, M ^a   Dainese, M ^a   Aronsson, C ^a   Leisner, P ^b   Ostling M ^c  

^a Replisaurus Technologies   (Sweden)

^b ACREO AB   (Sweden)

^c ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

Copper interconnects; ECPR; Electroplating; Imprinting; Metal printing

Indexed keywords

COPPER; ELECTROCHEMISTRY; ELECTRODES; ELECTROPLATING; SCANNING ELECTRON MICROSCOPY;

COPPER INTERCONNECTS; ECPR; IMPRINTING; METAL PRINTING;

OPTICAL INTERCONNECTS;

EID: 33646493695     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2006.01.208     Document Type: Article

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