3D-antenna-in-package solution for microwave wireless sensor network nodes

IEEE Transactions on Antennas and Propagation

Volumn 59, Issue 10, 2011, Pages 3617-3623

  Enayati, Amin ^a,b   Brebels, Steven ^a   De Raedt, Walter ^a   Vandenbosch, Guy A E ^b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

Dipole antenna; RF and microwave packaging; three dimensional packaging; wireless sensor networks

Indexed keywords

ANTENNA IN PACKAGES; CUBIC GEOMETRY; MEASUREMENT AND SIMULATION; PACKAGING SOLUTIONS; RADIATING ANTENNAS; RETURN LOSS; RF AND MICROWAVE PACKAGING; WIRELESS SENSOR;

DIPOLE ANTENNAS; IMAGE RECORDING; MICROWAVE SENSORS; PACKAGING; SENSOR NODES; THREE DIMENSIONAL;

DIRECTIONAL PATTERNS (ANTENNA);

EID: 80053620530     PISSN: 0018926X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TAP.2011.2163779     Document Type: Article

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