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Volumn 46, Issue 4, 2010, Pages 287-288

Vertical via-less transition in MCM technology for millimetre-wave applications

Author keywords

[No Author keywords available]

Indexed keywords

COMMUNICATIONS SYSTEMS; DESIGN PROCEDURE; LOW INSERTION LOSS; MICROSTRIP TRANSITIONS; MICROSTRIPES; MULTI-CHIP MODULE TECHNOLOGIES; SIMULATION AND MEASUREMENT; WAVE FREQUENCIES;

EID: 77149127683     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el.2010.3262     Document Type: Article
Times cited : (9)

References (7)
  • 1
    • 0035440557 scopus 로고    scopus 로고
    • Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits
    • 1521-3331
    • Carchon, G., Vaesen, K., Brebels, S., Raedt, W.D., Beyne, E., and Nauwelaers, B.: ' Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits ', IEEE Trans. Compon. Packag. Technol., 2001, 24, (3), p. 510-519 1521-3331
    • (2001) IEEE Trans. Compon. Packag. Technol. , vol.24 , Issue.3 , pp. 510-519
    • Carchon, G.1    Vaesen, K.2    Brebels, S.3    Raedt, W.D.4    Beyne, E.5    Nauwelaers, B.6
  • 2
    • 18744413607 scopus 로고    scopus 로고
    • A microstip-to-microstrip hot-via transition up to 80GHz designed for direct PCB mounting of MMICs
    • Amsterdam, The Netherlands
    • Saboureau, C., Baillargeat, D., Verdeme, S., Bessemoulin, A., Bois, J.R., and Quentin, P.: ' A microstip-to-microstrip hot-via transition up to 80GHz designed for direct PCB mounting of MMICs ', Proc. 34th Euro. Microwave Conf., Amsterdam, The Netherlands, 2004, p. 653-656
    • (2004) Proc. 34th Euro. Microwave Conf. , pp. 653-656
    • Saboureau, C.1    Baillargeat, D.2    Verdeme, S.3    Bessemoulin, A.4    Bois, J.R.5    Quentin, P.6
  • 3
    • 67649172865 scopus 로고    scopus 로고
    • Wideband vertical transitions for multilayer BCB-based MCM
    • 0895-2477
    • Ding, X., Geng, F., and Luo, L.: ' Wideband vertical transitions for multilayer BCB-based MCM ', Microw. Opt. Technol. Lett., 2009, 51, (6), p. 1584-1587 0895-2477
    • (2009) Microw. Opt. Technol. Lett. , vol.51 , Issue.6 , pp. 1584-1587
    • Ding, X.1    Geng, F.2    Luo, L.3
  • 4
    • 62349141069 scopus 로고    scopus 로고
    • High performance vertical transition from DC to 70GHz for system-on-package applications
    • Amsterdam, The Netherlands
    • Ju, I., Jom, I.B., Lee, H.S., and Oh, S.H.: ' High performance vertical transition from DC to 70GHz for system-on-package applications ', Proc. 38th Euro. Microwave Conf., Amsterdam, The Netherlands, 2008, p. 1338-1341
    • (2008) Proc. 38th Euro. Microwave Conf. , pp. 1338-1341
    • Ju, I.1    Jom, I.B.2    Lee, H.S.3    Oh, S.H.4
  • 5
    • 77149180825 scopus 로고    scopus 로고
    • Vertical transition in multilayer millimetre wave module using circular cavity
    • Wu, D., Fan, Y., Zhao, M., and Zhang, Y.: ' Vertical transition in multilayer millimetre wave module using circular cavity ', Prog. Electromagn. Res., 2008, 5, p. 91-100
    • (2008) Prog. Electromagn. Res. , vol.5 , pp. 91-100
    • Wu, D.1    Fan, Y.2    Zhao, M.3    Zhang, Y.4
  • 6
    • 33747601388 scopus 로고    scopus 로고
    • On-wafer measurement of misrostrip-based circuits with a broadband vialess transition
    • 1521-3323
    • Zhu, L., and Melde, K.L.: ' On-wafer measurement of misrostrip-based circuits with a broadband vialess transition ', IEEE Trans. Adv. Packag., 2006, 29, p. 654-659 1521-3323
    • (2006) IEEE Trans. Adv. Packag. , vol.29 , pp. 654-659
    • Zhu, L.1    Melde, K.L.2
  • 7
    • 35349000727 scopus 로고    scopus 로고
    • Ultra wideband vertical microstrip-microstrip transition
    • Abbosh, A.M.: ' Ultra wideband vertical microstrip-microstrip transition ', IET Microw. Antennas Propag., 2007, 1, (5), p. 968-972
    • (2007) IET Microw. Antennas Propag. , vol.1 , Issue.5 , pp. 968-972
    • Abbosh, A.M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.