A 3D wideband package solution using MCM-D BCB technology for tile TR module

GAAS 2005 Conference Proceedings - 13th European Gallium Arsenide and Other Compound Semiconductors Application Symposium

Volumn 2005, Issue , 2005, Pages 549-552

  Barbier, T ^a   Mazel, F ^b   Reig, B ^c   Monfraix, P ^d  

^a THALES   (France)

^b THALES Microwave   (France)

^c THALES RESEARCH AND TECHNOLOGY   (France)

^d THALES ALENIA SPACE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL ENGINEERING; ENVIRONMENTAL IMPACT; HERMETIC DEVICES; INTERCONNECTION NETWORKS; NATURAL FREQUENCIES;

AIRBORNE ENVIRONMENTAL CONSTRAINTS; BCB SUBSTRATES; HERMETIC ARCHITECTURE; TR MODULE;

ELECTRONICS PACKAGING;

EID: 33847222728     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)