3D integration with PCB technology

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 2006, Issue , 2006, Pages 857-863

  De Jong, E C W ^a   Ferreira, J A ^a   Bauer, P ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

3D-FOLDING PACKAGING METHOD; FOIL WINDING; HIGH DENSITY PACKAGING; MICROELECTRONIC INDUSTRY;

DIGITAL IMAGE STORAGE; ELECTRONICS PACKAGING; LAMINATES; MICROELECTRONICS; POWER CONVERTERS; POWER ELECTRONICS; THREE DIMENSIONAL; VIDEO CAMERAS;

PRINTED CIRCUIT BOARDS;

EID: 33749515803     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (30)

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