3D packaging technology for integrated antenna front-ends

Proceedings of the 38th European Microwave Conference, EuMC 2008

Volumn , Issue , 2008, Pages 1569-1572

  Bonnet, Barbara ^a   Monfraix, Philippe ^a   Chiniard, Renaud ^b   Chaplain, Jérôme ^c   Drevon, Claude ^a   Legay, Hervé ^a   Couderc, Pascal ^c   Cazaux, Jean Louis ^a  

^a THALES ALENIA SPACE   (France)

^b THALES RESEARCH AND TECHNOLOGY   (France)

^c 3D Plus ^*  (France)

Author keywords

[No Author keywords available]

Indexed keywords

MICROWAVES; RECEIVING ANTENNAS;

3-D PACKAGING; ACTIVE ELEMENTS; BUILDING BLOCKS; INTEGRATED ANTENNAS; K A BANDS; MULTI-CHIP MODULES; NOVEL CONCEPTS; RADIATING SURFACES; RECEIVE ANTENNAS;

MICROWAVE ANTENNAS;

EID: 62349095900     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMC.2008.4751769     Document Type: Conference Paper

References (9)

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