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Volumn , Issue , 2009, Pages 793-796

Effective die-package-PCB co-design methodology and its deployment in 10 Gbps serial link transceiver FPGA packages

Author keywords

Design methodology; Multilayers; Packaging; System analysis and design; System modeling

Indexed keywords

BGA PACKAGE; CO-DESIGN METHODOLOGY; COSIMULATION; DESIGN METHODOLOGY; FPGA APPLICATIONS; GBPS SERIAL LINKS; HIGH-SPEED TRANSCEIVERS; MODELING TECHNIQUE; MULTI-CHANNEL; PACKAGING SYSTEM; RETURN LOSS;

EID: 77949980610     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2009.5165816     Document Type: Conference Paper
Times cited : (10)

References (6)
  • 1
    • 51349085165 scopus 로고    scopus 로고
    • Study of fundamental limit and packaging technology solutions for 40-Gbps transceiver package design
    • May
    • Hong Shi, Xiaohong Jiang and John Xie, "Study of fundamental limit and packaging technology solutions for 40-Gbps transceiver package design", 2008 Electronic Components and Technology Conference Dig., pp. 1128-1131, May 2008.
    • (2008) 2008 Electronic Components and Technology Conference Dig , pp. 1128-1131
    • Shi, H.1    Jiang, X.2    Xie, J.3
  • 2
    • 34250332696 scopus 로고    scopus 로고
    • A practical method for modeling PCB transmission lines with conductor surface roughness and wideband dielectric properties
    • Tao Liang, Stephen Hall, Howard Keck, Gary Brist, "A practical method for modeling PCB transmission lines with conductor surface roughness and wideband dielectric properties", 2006 IEEE MTT-S Int. Microwave Symp. Dig., pp. 1780-1783.
    • (2006) IEEE MTT-S Int. Microwave Symp. Dig , pp. 1780-1783
    • Liang, T.1    Hall, S.2    Keck, H.3    Brist, G.4
  • 3
    • 77949945390 scopus 로고    scopus 로고
    • Vertically tapered transmission line for optimal signal transition in high-speed multi-layer BGA packages
    • Patent pending
    • Xiaohong Jiang, Hong Shi, "Vertically tapered transmission line for optimal signal transition in high-speed multi-layer BGA packages", Patent pending.
    • Jiang, X.1    Shi, H.2
  • 4
    • 77949983699 scopus 로고    scopus 로고
    • Optimal Ball Breakout Pattern for Cost Effective Transceiver BGA Package Design
    • Patent pending
    • Xiaohong Jiang, Hong Shi, "Optimal Ball Breakout Pattern for Cost Effective Transceiver BGA Package Design", Patent pending.
    • Jiang, X.1    Shi, H.2
  • 5
    • 51349096646 scopus 로고    scopus 로고
    • Package substrate built-in three-dimensional distributed matching circuit for high-speed SerDes applications
    • May
    • Ryuichi Oikawa, "Package substrate built-in three-dimensional distributed matching circuit for high-speed SerDes applications", 2008 Electronic Components and Technology Conference Dig., pp. 676-682, May 2008.
    • (2008) 2008 Electronic Components and Technology Conference Dig , pp. 676-682
    • Oikawa, R.1
  • 6
    • 77949932723 scopus 로고    scopus 로고
    • An enabling technique for multi-port VNA measurement with microprobes using de-embedding
    • March
    • Orlando Bell, et. all, "An enabling technique for multi-port VNA measurement with microprobes using de-embedding", GigaTest Labs Application Note 105, March, 2007.
    • (2007) GigaTest Labs Application Note , vol.105
    • Bell, O.1    et. all2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.