Microcontact printing of monodiamond nanoparticles: An effective route to patterned diamond structure fabrication

Langmuir

Volumn 27, Issue 19, 2011, Pages 11981-11989

  Zhuang, Hao ^a   Song, Bo ^a   Staedler, Thorsten ^a   Jiang, Xin ^a  

^a UNIVERSITY OF SIEGEN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION KINETICS; CHEMICAL VAPOR DEPOSITION DIAMOND; CVD DIAMOND; DAMAGE-FREE; DEPOSITION METHODS; DEPOSITION TIME; DETONATION NANODIAMONDS; DIAMOND STRUCTURES; EXPANSION RATE; EXPONENTIAL LAW; GENERAL PATTERNS; INTERACTION ENERGIES; LOW EXPANSION; MICRO CONTACT PRINTING; MICROWAVE PLASMA CHEMICAL VAPOR DEPOSITION SYSTEM; MONODISPERSE; NANO DIAMOND; POLYDIMETHYLSILOXANE PDMS; SEEDED SUBSTRATES; SEEDING TECHNIQUES; SILICON SURFACES; THEORETICAL CALCULATIONS; THIN LAYERS; TRANSFER RATIO;

ADSORPTION; ELECTRON DEVICE MANUFACTURE; ESTERS; INDUSTRIAL APPLICATIONS; MICROCHANNELS; PLASMA DEPOSITION; PRINTING; SUBSTRATES; SYNTHETIC DIAMONDS;

CHEMICAL VAPOR DEPOSITION;

EID: 80053314377     PISSN: 07437463     EISSN: 15205827     Source Type: Journal    
DOI: 10.1021/la2024428     Document Type: Article

References (47)

1. Nebel, C. E., Ristein, W., Eds. Thin-Film Diamond I; Elsevier: Amsterdam, 2003.
2. Nebel, C. E., Ristein, W., Eds. Thin-Film Diamond II; Elsevier: Amsterdam, 2004.
3. Nazaré, M. H., Neves, A. J., Eds. Properties, Growth and Applications of Diamond; Institution of Electrical Engineers: London, 2001.
4. Cao, Z. L.; Aslam, D. Diamond Relat. Mater. 2010, 19, 1263-1272
5. Haertl, A.; Schmich, E.; Garrido, J. A.; Hernando, J.; Catharino, S. C. R.; Walter, S.; Feulner, P.; Kromka, A.; Steinmueller, D.; Stutzmann, M. Nat. Mater. 2004, 3, 736-742
6. Yang, W. S.; Auciello, O.; Butler, J. E.; Cai, W.; Carlisle, J. A.; Gerbi, J.; Gruen, D. M.; Knickerbocker, T.; Lasseter, T. L.; Russell, J. N.; Smith, L. M.; Hamers, R. J. Nat. Mater. 2002, 1, 253-257
7. Davidson, J. L.; Kang, W. P.; Wisitsora-At, A. Diamond Relat. Mater. 2003, 12, 429-433
8. Wang, S. G.; Zhang, Q.; Yoon, S. E.; Ahn, J.; Zhou, Q.; Wang, Q.; Yang, D. J.; Li, J. Q.; Shanyong, S. Z. Surf. Coat. Technol. 2003, 167, 143-147
9. Kawabata, Y.; Taniguchi, J.; Miyamoto, I. Diamond Relat. Mater. 2004, 13, 93-98
10. Kiyohara, S.; Yagi, Y.; Mori, K. Nanotechnology 1999, 10, 385-388
11. Jiang, X.; Boettger, E.; Paul, M.; Klages, C. P. Appl. Phys. Lett. 1994, 65, 1519-1521
12. Chen, Y. C.; Tzeng, Y.; Cheng, A. J.; Dean, R.; Park, M.; Wilamowski, B. M. Diamond Relat. Mater. 2009, 18, 146-150
13. Kromka, A.; Babchenko, O.; Rezek, B.; Ledinsky, M.; Hruska, K.; Potmesil, J.; Vanecek, M. Thin Solid Films 2009, 518, 343-347
14. Babchenko, O.; Izak, T.; Ukraintsev, E.; Hruska, K.; Rezek, B.; Kromka, A. Phys. Status Solidi B 2010, 247, 3026-3029
15. Lee, S. K.; Kim, J. H.; Jeong, M. G.; Song, M. J.; Lim, D. S. Nanotechnology 2010, 21, 505302
16. Fox, N. A.; Youh, M. J.; Steeds, J. W.; Wang, W. N. J. Appl. Phys. 2000, 87, 8187-8191
17. Davidson, J. L.; Ellis, C.; Ramesham, R. J. Electron. Mater. 1989, 18, 711-715
18. Mirzakuchaki, S.; Hajsaid, M.; Golestanian, H.; Roychoudhury, R.; Charlson, E. J.; Charlson, E. M.; Stacy, T. Appl. Phys. Lett. 1995, 67, 3557-3559
19. Sakamoto, Y.; Takaya, M.; Sugimura, H.; Takai, O.; Nakagiri, N. Thin Solid Films 1998, 334, 161-164
20. Ross, R. J.; Boit, C. In Microelectronics Failure Analysis: Desk Reference, 5 th ed.; The Electronic Device Failure Analysis Society, Desk Reference Committee, Ed.; ASM International: Materials Park, OH, 2004.
21. Kumar, A.; Biebuyck, H. A.; Whitesides, G. M. Langmuir 1994, 10, 1498-1511
22. Wilbur, J. L.; Kumar, A.; Biebuyck, H. A.; Kim, E.; Whitesides, G. M. Nanotechnology 1996, 7, 452-457
23. Kraus, T.; Malaquin, L.; Delamarche, E.; Schmid, H.; Spencer, N. D.; Wolf, H. Adv. Mater. 2005, 17, 2438-2442
24. Kumar, A.; Whitesides, G. M. Appl. Phys. Lett. 1993, 63, 2002-2004
25. Cui, Y.; Bjork, M. T.; Liddle, J. A.; Sonnichsen, C.; Boussert, B.; Alivisatos, A. P. Nano Lett. 2004, 4, 1093-1098
26. Kim, Y. H.; Park, J.; Yoo, P. J.; Hammond, P. T. Adv. Mater. 2007, 19, 4426-4430
27. Kraus, T.; Malaquin, L.; Schmid, H.; Riess, W.; Spencer, N. D.; Wolf, H. Nat. Nanotechnol. 2007, 2, 570-576
28. Arrington, D.; Curry, M.; Street, S. C. Langmuir 2002, 18, 7788-7791
29. Lange, S. A.; Benes, V.; Kern, D. P.; Horber, J. K. H.; Bernard, A. Anal. Chem. 2004, 76, 1641-1647
30. Bernard, A.; Renault, J. P.; Michel, B.; Bosshard, H. R.; Delamarche, E. Adv. Mater. 2000, 12, 1067-1070
31. James, C. D.; Davis, R. C.; Kam, L.; Craighead, H. G.; Isaacson, M.; Turner, J. N.; Shain, W. Langmuir 1998, 14, 741-744
32. Singhvi, R.; Kumar, A.; Lopez, G. P.; Stephanopoulos, G. N.; Wang, D. I. C.; Whitesides, G. M.; Ingber, D. E. Science 1994, 264, 696-698
33. Williams, O. A.; Douheret, O.; Daenen, M.; Haenen, K.; Osawa, E.; Takahashi, M. Chem. Phys. Lett. 2007, 445, 255-258
34. Lee, S. T.; Lin, Z. D.; Jiang, X. Mater. Sci. Eng., R 1999, 25, 123-154
35. Duffy, D. C.; McDonald, J. C.; Schueller, O. J. A.; Whitesides, G. M. Anal. Chem. 1998, 70, 4974-4984
36. Israelachvili, J. N., Intermolecular and Surface Forces, 2 nd ed.; Academic Press: San Diego, 1991.
37. Malecha, K.; Gancarz, I.; Golonka, L. J. J. Micromech. Microeng. 2009, 19, 105016
38. Karkhaneh, A.; Mirzadeh, H.; Ghaffariyeh, A. R. J. Appl. Polym. Sci. 2007, 105, 2208-2217
39. Ohshima, H. J. Colloid Interface Sci. 1995, 174, 45-52
40. Osawa, E. Pure Appl. Chem. 2008, 80, 1365-1379
41. Coltro, W. K. T.; Lunte, S. M.; Carrilho, E. Electrophoresis 2008, 29, 4928-4937
42. Wang, L. L.; Friesner, R. A.; Berne, B. J. J. Phys. Chem. B 2010, 114, 7294-7301
43. Brant, J. A.; Childress, A. E. Environ. Eng. Sci. 2002, 19, 413-427
44. Hoek, E. M. V.; Agarwal, G. K. J. Colloid Interface Sci. 2006, 298, 50-58
45. Cooper, K.; Gupta, A.; Beaudoin, S. J. Colloid Interface Sci. 2001, 234, 284-292
46. Ruiz, S. A.; Chen, C. S. Soft Matter 2007, 3, 168-177
47. Scarpettini, A. F.; Bragas, A. V. Langmuir 2010, 26, 15948-15953