Applications driving 3D integration and 1 corresponding manufacturing challenges

Proceedings - Design Automation Conference

Volumn , Issue , 2011, Pages 220-223

  Topaloglu, Rasit ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

3D; applications; architecture; bonding; challenges EDA; cost; integration; manufacturing; MEMS; optical; reliability; RF; technology; testing; thermal

Indexed keywords

3D; CHALLENGES EDA; OPTICAL; RF; THERMAL;

COMPUTER AIDED DESIGN; INDUSTRIAL RESEARCH; INTEGRATION; MANUFACTURE;

THREE DIMENSIONAL;

EID: 80052679015     PISSN: 0738100X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

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