Thermal-stability enhancement of InGaP/GaAs collector-up HBTs

IEEE Transactions on Device and Materials Reliability

Volumn 11, Issue 3, 2011, Pages 387-390

  Tseng, Hsien Cheng ^a   Li, Jian Kwan ^a   Chen, Tze Wei ^a  

^a KUN SHAN UNIVERSITY   (Taiwan)

Author keywords

Genetic algorithm (GA); heat spreading structure (HSS); heterojunction bipolar transistors (HBTs); optimization; thermal stability

Indexed keywords

CELLULAR PHONE; EXISTING STRUCTURE; HEAT-SPREADING STRUCTURE (HSS); INGAP/GAAS; MULTIFINGERS; NOVEL DESIGN; POWER-ADDED EFFICIENCY; RF PERFORMANCE; THERMAL PARAMETERS;

COLLECTOR EFFICIENCY; GENETIC ALGORITHMS; HEAT RESISTANCE; HETEROJUNCTIONS; OPTIMIZATION; POWER AMPLIFIERS; THERMODYNAMIC STABILITY;

HETEROJUNCTION BIPOLAR TRANSISTORS;

EID: 80052621964     PISSN: 15304388     EISSN: 15582574     Source Type: Journal    
DOI: 10.1109/TDMR.2011.2141995     Document Type: Article

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