Room-temperature reactive bonding by using nano scale multilayer systems

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11

Volumn , Issue , 2011, Pages 1332-1335

  Braeuer, J ^a   Besser, J ^a   Wiemer, M ^a   Gessner, T ^a,b  

^a FRAUNHOFER INSTITUTE FOR ELECTRONIC NANO SYSTEMS ENAS   (Germany)

^b CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Exothermic reaction; Integrated multilayer systems; Reactive bonding; Ti a Si multilayer

Indexed keywords

INTEGRATED MULTILAYERS; INTERNAL HEAT SOURCE; MULTI-LAYER SYSTEM; NANO SCALE; REACTION FRONT; REACTIVE BONDING; ROOM TEMPERATURE; SUBSTRATE MATERIAL; TIN FILMS; VERY THIN FILMS;

ACTUATORS; EXOTHERMIC REACTIONS; FILM PREPARATION; MICROSYSTEMS; MULTILAYERS; REACTION KINETICS; SOLID-STATE SENSORS; SUBSTRATES; TIN; WET ETCHING;

MULTILAYER FILMS;

EID: 80052122454     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/TRANSDUCERS.2011.5969498     Document Type: Conference Paper

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