Fabrication and characterization of reactive nanoscale multilayer systems for low-temperature bonding in microsystem technology

Journal of Micromechanics and Microengineering

Volumn 20, Issue 6, 2010, Pages

  Boettge, Bianca ^a   Braeuer, Joerg ^b   Wiemer, Maik ^b   Petzold, Matthias ^a   Bagdahn, Joerg ^c   Gessner, Thomas ^b  

^a FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

^b FRAUNHOFER INSTITUTE FOR ELECTRONIC NANO SYSTEMS ENAS   (Germany)

^c FRAUNHOFER CENTER FOR SILICON PHOTOVOLTAICS CSP   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALTERNATIVE MATERIALS; ASSEMBLY TECHNOLOGY; BILAYER SYSTEMS; BOND INTERFACE; BOND STRUCTURES; BONDING PROCESS; COEFFICIENT OF THERMAL EXPANSION; DIE ATTACHMENT; HIGH POTENTIAL; INTEGRATED MICROSYSTEMS; JOINING PROCESS; LOW TEMPERATURE BONDING; LOW TEMPERATURES; MICRO-SYSTEM TECHNOLOGIES; MICROSYSTEM APPLICATIONS; MULTI-LAYER SYSTEM; NANOSCALE MULTILAYERS; SELF-PROPAGATING; SILICON SUBSTRATES; STAINLESS STEEL MEMBRANE; STRAIN GAUGE; TEMPERATURE-SENSITIVE; TENSILE TESTS;

BONDING; DIFFERENTIAL SCANNING CALORIMETRY; GAGES; HIGH RESOLUTION ELECTRON MICROSCOPY; MULTILAYER FILMS; MULTILAYERS; NANOSTRUCTURED MATERIALS; POLYMER BLENDS; QUARTZ; SCANNING ELECTRON MICROSCOPY; STAINLESS STEEL; TENSILE STRENGTH; TENSILE TESTING; THERMAL EXPANSION;

MICROSYSTEMS;

EID: 78650878647     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/6/064018     Document Type: Article

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