Wetting behaviour and reactivity of lead free Au-In-Sn and Bi-In-Sn alloys on copper substrates

International Journal of Adhesion and Adhesives

Volumn 27, Issue 5, 2007, Pages 409-416

  Gnecco, F ^a   Ricci, E ^a   Amore, S ^a,b   Giuranno, D ^a   Borzone, G ^b   Zanicchi, G ^b   Novakovic, R ^a  

^a CNR   (Italy)

^b UNIVERSITY OF GENOA   (Italy)

Author keywords

Contact angles; Interfaces; Lead free solder alloys; Metals

Indexed keywords

CONTACT ANGLE; COPPER; ELECTRONICS INDUSTRY; INTERFACES (MATERIALS); METALS; REACTION KINETICS; SUBSTRATES; WETTING;

CONTACT ANGLE MEASUREMENTS; LEAD-FREE SOLDER ALLOYS; TERNARY MOLTEN ALLOYS;

GOLD ALLOYS;

WETTING;

EID: 33847242182     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2006.09.008     Document Type: Article

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