High-rate reduction of copper oxide using atmospheric-pressure inductively coupled plasma microjets

Thin Solid Films

Volumn 519, Issue 20, 2011, Pages 6773-6777

  Tajima, Satomi ^a   Tsuchiya, Shouichi ^a   Matsumori, Masashi ^b   Nakatsuka, Shigeki ^b   Ichiki, Takanori ^a  

^a UNIVERSITY OF TOKYO   (Japan)

^b Panasonic Factory Solutions Co Ltd   (Japan)

Author keywords

Atmospheric pressure plasma; Cu2O; CuO; Microplasma; Reduction

Indexed keywords

ATMOSPHERIC PRESSURE PLASMAS; CHEMICAL BONDING STATE; CU LAYERS; CU SURFACES; CUO; CUPRIC OXIDE; CUPROUS OXIDE; DYNAMIC BEHAVIORS; HIGH RATE; HIGH-DENSITY; INDUCTIVELY-COUPLED; INPUT POWER; MICRO-JET; MICRO-PLASMA JET; MICRO-PLASMAS; OPTICAL EMISSIONS; RAPID REDUCTION; REDUCTION PROCESS; SUBSTRATE TEMPERATURE; THERMAL-ANNEALING;

ATMOSPHERIC CHEMISTRY; CHEMICAL BONDS; INDUCTIVELY COUPLED PLASMA; METAMATERIALS; PLASMA DEVICES;

REDUCTION;

EID: 80051550495     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2011.01.219     Document Type: Conference Paper

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