Conductive ink for through hole application

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 3, 2001, Pages 445-449

  Xiao, Allison Y ^a   Tong, Quinn K ^a   Savoca, Ann C ^a   Van Oosten, Hans ^a,b  

^a NATIONAL STARCH AND CHEMICAL COMPANY   (United States)

^b Acheson Colloiden B V   (Netherlands)

Author keywords

Conductive ink; CTE; Glass transition; PWB; Solder bath; Through hole; Unstable conductivity

Indexed keywords

CURING; DYNAMIC MECHANICAL ANALYSIS; ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; FAILURE (MECHANICAL); GLASS TRANSITION; PRINTED CIRCUIT BOARDS; TEMPERATURE; THERMAL CYCLING; THERMAL EXPANSION;

CONDUCTIVE INK; ELECTRICAL INTERCONNECT; SILVER THROUGH HOLE; SOLDER BATH;

CONDUCTIVE MATERIALS;

EID: 0035441360     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.946492     Document Type: Article

References (7)

1. Conductive adhesives with stable contact resistance and superior impact performance
2. Conductive adhesive-making the no-lead connection
3. IC density drives array packages