Low cycle isothermal fatigue properties of lead-free solders

Soldering and Surface Mount Technology

Volumn 19, Issue 4, 2007, Pages 25-32

  Dušek, Miloš ^a   Hunt, Christopher ^a  

^a NATIONAL PHYSICAL LABORATORY   (United Kingdom)

Author keywords

Fatigue; Solders

Indexed keywords

COMPUTER SIMULATION; CRACKS; FATIGUE OF MATERIALS; LAWS AND LEGISLATION; MICROELECTRONICS; STRAIN RATE;

ENERGY DENSITY; INTERCONNECT PROPERTIES; RESISTANCE MONITORING; ROHS LEGISLATION;

SOLDERED JOINTS;

EID: 36949015177     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910710848527     Document Type: Article

References (8)

1. Astrom, K.J. and Hagglund, T. (1995), PID Controllers: Theory, Design, and Tuning, 2nd ed., International Society for Measurement and Control, Seattle, WA.
2. Clech, J.P. (2005), "Acceleration factors and thermal cycling test efficiency for lead-free Sn-Ag-Cu assemblies", Proceedings of SMTA International Chicago, p. 902.
3. Dusek, M. and Hunt, C. (2005), "The measurement of creep rates and stress relaxation for micro sized lead-free solder joints", NPL Report DEPC-MPR 021, April 2005.
4. Dusek, M. and Hunt, C. (2006), "Test approach to isothermal fatigue measurements for lead-free solders", NPL Report DEPC-MPR 048, March.
5. IEC 62137-1-5 standard (2007), "Environmental and endurance test methods for surface mount solder joints - Part 5 mechanical shear fatigue test", Draft.
6. Pang, J.H.L. (2003), "Bulk solder and solder joint properties for lead-free 95.5Sn-3.8Ag-0.7Cu solder alloy", Conference Proceedings ECTC 2003 International, Chicago.
7. Plumbridge, W., Matela, R.J. and Westwater, A. (2003), Structural Integrity and Reliability in Electronics, Kluwer Academic Publishers, Dordrecht.
8. Wassink, K.R.J. (1989), Soldering in Electronics, 2nd ed., Electrochemical Publications, Port Erin, p. 468.