Optical interconnects for board level applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7219, Issue , 2009, Pages

  Dangel, R ^a   Beyeler, R ^a   Meier, N ^a   Lamprecht, T ^a   Horst, F ^a   Jubin, D ^a   Weiss, J ^a   Offrein, B J ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

Author keywords

Optical interconnects; Optical packaging; Polymer waveguides

Indexed keywords

BOARD-LEVEL; HIGH DENSITY; OPTICAL CONNECTORS; OPTICAL PACKAGING; PASSIVE ALIGNMENT; POLYMER WAVEGUIDES; SYSTEM BANDWIDTH;

INTEGRATED OPTICS; INTEGRATED OPTOELECTRONICS; OPTICAL INTERCONNECTS; PAPER SHEETING; POLYMERS; SUPERCOMPUTERS; WAVEGUIDE COMPONENTS;

INTEGRATED CIRCUITS;

EID: 67649202573     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.811128     Document Type: Conference Paper

References (8)

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8. Fuad E. Doany, Clint L. Schow, Jeffrey A. Kash, Christian Baks, Russell Budd, Daniel M. Kuchta, Petar Pepeljugoski, Frank Libsch, Roger Dangel, Folkert Horst, Bert J. Offrein, Waveguide-coupled parallel optical transceiver technology for Tb/s-class chip-to-chip data transmission, Photonics West 2008, San Jose, Paper 6899-28, Proc. SPIE, Vol. 6899, 2008.