Process characterization of pitch-split resist materials for application at 16nm node

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7639, Issue , 2010, Pages

  Holmes, Steven J ^a   Tang, Cherry ^b   Arnold, John C ^c   Yin, Yunpeng ^d   Chen, Rex ^d   Fender, Nicolette ^b   Osborn, Brian ^b   Dabbagh, Gary ^b   Liu, Sen ^d   Colburn, Matthew ^a   Varanasi, Rao P ^d   Slezak, Mark ^b  

^a IBM RESEARCH   (United States)

^b JSR Micro   (United States)

^c IBM T J WATSON RESEARCH CENTER   (United States)

^d IBM   (United States)

Author keywords

16 nm node lithography; double patterning; pitch split; thermal cure

Indexed keywords

CU-RE SYSTEM; CYCLE TIME; DOUBLE PATTERNING; LITHOGRAPHIC PROCESSING; PITCH VALUES; PROCESS CHARACTERIZATION; PROCESS TECHNIQUES; PROCESS WINDOW; RESIST MATERIALS; SEMICONDUCTOR INDUSTRY; SEMICONDUCTOR STRUCTURE;

COST REDUCTION; CURING; DEFECTS; LITHOGRAPHY; NANOTECHNOLOGY; PROCESSING; SEMICONDUCTOR DEVICE MANUFACTURE;

MATERIALS;

EID: 77953526258     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.846891     Document Type: Conference Paper

References (4)

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2. A. Hazelton, S. Wakamoto, S. Hirukawa, M. McCallum, N. Magome, J. Ishikawa, C. Lapeyre, I. Guilmeau, S. Barnola, S. Gaugiran, Proc. SPIE " Double patterning requirements for optical lithography and prospects for optical extension without double patterning" (2008),
3. G. Wakamatsu, Y. Anno, M. Hori, T. Kakizawa, M. Mita, K. Hoshiko, T. Shioya, K. Fujiwara, S. Kusumoto, Y. Yamaguchi, T. Shimokawa, Proc. SPIE "Double pattern process with freezing technique" (2009)
4. M. Hori, T. Nagai, A. Nakamura, T. Abe, G. Wakamatsu, T. Kakizawa, Y. Anno, M. Sugiura, S. Kusumoto, Y. Yamaguchi, T. Shimokawa, Proc. SPIE "Sub-40 nm half-pitch double patterning with resist freezing process" (2008)