UV-nanoimprinting using non-transparent molds and non-transparent substrates

Microelectronic Engineering

Volumn 88, Issue 8, 2011, Pages 2004-2008

  Kirchner, R ^a   Finn, A ^a   Teng, L ^a   Ploetner, M ^a   Jahn, A ^a   Nueske, L ^b   Fischer, W J ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

^b FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS   (Germany)

Author keywords

Antisticking layer; Non transparent mold; NT UV NIL; Opaque mold; UV nanoimprint

Indexed keywords

ANTISTICKING LAYERS; NON-TRANSPARENT MOLD; NT-UV-NIL; OPAQUE MOLD; UV-NANOIMPRINT;

IRRADIATION; NANOIMPRINT LITHOGRAPHY; SILICON COMPOUNDS; SUBSTRATES;

MOLDS;

EID: 79960030952     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2011.01.066     Document Type: Conference Paper

References (16)

1. S.Y. Chou, P.R. Krauss, and P.J. Renstrom Appl. Phys. Lett. 67 1995 3114 3116
2. H. Schmitt, M. Rommel, A.J. Bauer, L. Frey, A. Bich, M. Eisner, R. Voelkel, and M. Hornung Microelectron. Eng. 87 2010 1074 1076
3. C.A. Mills, E. Martinez, F. Bessueille, G. Villanueva, J. Bausells, J. Samitier, and A. Errachid Microelectron. Eng. 78-79 2005 695 700
4. Y. Zhao, and T. Cui J. Micromech. Microeng. 13 2003 430 435
5. C.-Y. Chao, W. Fung, and L.J. Guo IEEE J. Quantum. Elect. 12 2006 134 142
6. J. Haisma, M. Verheijen, K. van den Heuvel, and J. van den Berg J. Vac. Sci. Technol. B 14 1996 4124 4128
7. J. Kettle, P. Coppo, G. Lalev, C. Tattershall, S. Dimov, and M. Turner Microelectron. Eng. 85 2008 850 852
8. Y. Ofir, I.W. Moran, C. Subramani, K.R. Carter, and V.M. Rotello Adv. Mater. 22 2010 3608 3614
9. H.-C. Scheer, H. Schulz, T. Hoffmann, C.M. Sotomayor-Torres, Handbook of Thin Film Materials, Nanomaterials and Magnetic Thin Films, vol. 5, Academic Press, 2002, pp. 49.
10. Y. Chen, F. Carcenac, C. Ecoffet, D.J. Lougnot, and H. Launois Microelectron. Eng. 46 1999 69 72
11. D. Truffier-Boutry, M. Zelsmann, J.D. Girolamo, J. Boussey, C. Lombard, and B. Pépin-Donat Appl. Phys. Lett. 94 2009 044110
12. H.S. Lee, D.S. Kim, and T.H. Kwon Microsyst. Technol. 13 2007 593 599
13. C.G.W. Michael, and D. Dickey AIChE J. 52 2006 777784
14. H. Schmitt, L. Frey, and H. Ryssel J. Vac. Sci. Technol. B 25 2007 785 790
15. C. Decker, and D. Decker Polymer 38 1997 2229 2237
16. L. Lecamp, B. Youssef, and C. Bunel Polymer 38 1997 6089 6096