An easy method to perform e-beam negative tone lift-off fabrication on dielectric material with a sandwiched conducting polymer layer

Journal of Micromechanics and Microengineering

Volumn 21, Issue 6, 2011, Pages

  Sundaram, V M ^a   Wen, S B ^a  

^a Department of Electrical and Computer Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BI-LAYER; DESIGN VALUE; E-BEAM LITHOGRAPHY; FOCUS DISTANCE; FUSED SILICA SUBSTRATES; HIGH ASPECT RATIO; HIGH NUMERICAL APERTURES; HIGH PRECISION; HIGH SPATIAL RESOLUTION; INSULATING SUBSTRATES; LIFT-OFF PROCESS; NEGATIVE TONES; PROXIMITY EFFECTS; ZONE PLATES;

ASPECT RATIO; CONDUCTING POLYMERS; DIELECTRIC MATERIALS; FUSED SILICA; NANOSTRUCTURES; OPTICAL INSTRUMENTS; ORGANIC CONDUCTORS; PLATES (STRUCTURAL COMPONENTS); SUBSTRATES;

FABRICATION;

EID: 79957966809     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/21/6/065021     Document Type: Article

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