Piezoelectric in situ transmission electron microscopy technique for direct observations of fatigue damage accumulation in constrained metallic thin films

Applied Physics Letters

Volumn 80, Issue 21, 2002, Pages 3946-3948

  Tan, X ^a   Du, T ^a   Shang, J K ^a  

^a University of Illinois at Urbana Champaign   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALTERNATING ELECTRIC FIELD; CYCLIC LOADINGS; DAMAGE MECHANISM; FATIGUE DAMAGE ACCUMULATION; FATIGUE DAMAGE MECHANISM; IN-SITU TRANSMISSION; METALLIC THIN FILMS; MULTI-LAYERED STRUCTURE; PIEZOELECTRIC ACTUATION; SILICON SUBSTRATES; STATIC OFFSETS; THIN METALLIC LAYER;

ELECTRIC FIELDS; FAILURE (MECHANICAL); IN SITU PROCESSING; PIEZOELECTRIC ACTUATORS; PIEZOELECTRICITY; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

FATIGUE DAMAGE;

EID: 79957952769     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1481768     Document Type: Article

References (25)

1. W. D. Nix, Metall. Trans. A 20A, 2217 (1989). mta MTTABN 0360-2133
2. F. M. d'Heurle, Int. Mater. Rev. 34, 53 (1989). irv INMREO 0950-6608
3. K. N. Subramanian, A. Lee, S. Choi, and P. Sonje, J. Electron. Mater. 30, 372 (2001). jem JECMA5 0361-5235
4. H. Okabayashi, Mater. Sci. Eng., R. 11, 191 (1993). msr MIGIEA 0927-796X
5. R. E. Hummel, Int. Mater. Rev. 39, 97 (1994). irv INMREO 0950-6608
6. C. K. Hu, K. P. Rodbell, T. D. Sullivan, K. Y. Lee, and D. P. Bouldin, IBM J. Res. Dev. 39, 465 (1995). ibm IBMJAE 0018-8646
7. M. E. Kassner, T. C. Kennedy, and K. K. Schrems, Acta Mater. 46, 6445 (1998). acz ACMAFD 1359-6454
8. G. M. Rauf, D. Maroudas, and L. J. Gray, Appl. Phys. Lett. 73, 3848 (1998). apl APPLAB 0003-6951
9. N. Shibagaki, K. Asai, T. Tabuchi, T. Hirashima, and M. Hikitaet, IEEE Ultrason. Symp. Proc., 439 (1991).
10. N. Kimura, M. Nakano, and K. Sato, Trans. Inst. Electron. Inf. Commun. Eng. C-I J80, 484 (1997). dtr DTRCEP 0915-1893
11. R. Tucoulou, M. Brunel, D. V. Roshchupkin, I. A. Schelokov, J. Colin, and J. Grilhe, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 46, 856 (1999). itu ITUCER 0885-3010
12. H.-J. Lee, G. Cornella, and J. C. Bravman, Appl. Phys. Lett. 76, 3415 (2000). apl APPLAB 0003-6951
13. R. R. Keller, J. M. Phelps, and D. T. Read, Mater. Sci. Eng., A 214, 42 (1996). msa MSAPE3 0921-5093
14. D. Jawarani and H. Kawasaki, J. Appl. Phys. 82, 171 (1997). jap JAPIAU 0021-8979
15. R. Venkatraman, J. C. Bravman, W. D. Nix, P. W. Davies, P. A. Flinn, and D. B. Fraser, J. Electron. Mater. 19, 1231 (1990). jem JECMA5 0361-5235
16. P. M. Anderson, T. Foecke, and P. M. Hazzledine, MRS Bull. 24, 27 (1999). mbu MRSBEA 0883-7694
17. M. J. Kobrinsky, and C. V. Thompson, Acta Mater. 48, 625 (2000). acz ACMAFD 1359-6454
18. R.-M. Keller-Flaig, M. Legros, W. Sigle, A. Gouldstone, K. J. Hemker, S. Suresh, and E. Arzt, J. Mater. Res. 14, 4673 (1999). jmr JMREEE 0884-2914
19. G. Dehm and E. Arzt, Appl. Phys. Lett. 77, 1126 (2000). apl APPLAB 0003-6951
20. G. Dehm, D. Weiss, and E. Arzt, Mater. Sci. Eng., A 309-310, 468 (2001). msa MSAPE3 0921-5093
21. A. G. Evans and B. J. Dalgleish, Acta Metall. Mater. 40, S295 (1992). amm AMATEB 0956-7151
22. Z. Xu, X. Tan, P. Han, and J. K. Shang, Appl. Phys. Lett. 76, 3732 (2000). apl APPLAB 0003-6951
23. X. Tan, Z. Xu, J. K. Shang, and P. Han, Appl. Phys. Lett. 77, 1529 (2000). apl APPLAB 0003-6951
24. T. Du, M. Liu, S. Seghi, K. J. Hsia, J. Economy, and J. K. Shang, J. Mater. Res. 16, 2885 (2001). jmr JMREEE 0884-2914
25. C. Laird, Fatigue Crack Propagation (American Society for Testing Materials, Philadelphia, 1967), p. 131.