Thermal characteristic analysis of high-power LEDs by structure functions

Guangdianzi Jiguang/Journal of Optoelectronics Laser

Volumn 20, Issue 4, 2009, Pages 454-457

  Zhang, Hai Bing ^a   Lu, Yi Jun ^a   Chen, Huan Ting ^a   Li, Kai Hang ^a   Gao, Yu Lin ^a   Chen, Zhong ^a   Chen, Guo Long ^a  

^a XIAMEN UNIVERSITY   (China)

Author keywords

High power LEDs; Metal core printed circuit board (MCPCB); Structure function; Thermal resistance

Indexed keywords

DIFFERENTIAL STRUCTURES; HIGH REPETITIONS; HIGH-POWER LEDS; METAL CORE PRINTED CIRCUIT BOARD (MCPCB); SAMPLING RESOLUTIONS; STRUCTURE FUNCTION; THERMAL CAPACITANCES; THERMAL CHARACTERISTICS; THERMAL CONDUCTIONS; THERMAL RESISTANCE; TRANSIENT DATUM; TRANSIENT TEMPERATURES;

ELECTROMAGNETIC WAVE EMISSION; HEAT RESISTANCE; METAL ANALYSIS; PRINTED CIRCUIT MANUFACTURE; SMELTING; THERMAL CONDUCTIVITY;

PRINTED CIRCUIT BOARDS;

EID: 65549088639     PISSN: 10050086     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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