Thermal analysis of multi-chip LED packages

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6355, Issue , 2006, Pages

  Kim, Lan ^a   Choi, Jonghwa ^a   Jang, Sunho ^a   Shin, Moo Whan ^a  

^a Myong Ji University   (South Korea)

Author keywords

GaN; Multi chip LED package; Structure functions; Thermal resistance; Thermal transient measurement

Indexed keywords

GALLIUM NITRIDE; HEAT LOSSES; HEAT RESISTANCE; LIGHT EMITTING DIODES;

MULTICHIP LED PACKAGE; STRUCTURE FUNCTIONS; THERMAL DESIGN RULE; THERMAL TRANSIENT MEASUREMENT;

CHIP SCALE PACKAGES;

EID: 33845619969     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.691560     Document Type: Conference Paper

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