A simple and efficient design procedure for planar electromagnetic bandgap structures on printed circuit boards

IEEE Transactions on Electromagnetic Compatibility

Volumn 53, Issue 2, 2011, Pages 482-490

  Raimondo, Leo ^a   De Paulis, Francesco ^a   Orlandi, Antonio ^a  

^a UNIVERSITY OF L'AQUILA   (Italy)

Author keywords

Electromagnetic bandgap (EBG); electromagnetic interference; power integrity; printed circuit boards

Indexed keywords

BAND GAPS; CLOSED FORM; EBG STRUCTURE; EFFICIENT DESIGNS; ELECTROMAGNETIC BAND GAPS; ELECTROMAGNETIC BANDGAP STRUCTURES; ELECTROMAGNETIC INTERFERENCE; POWER INTEGRITY; SYNTHESIS PROCEDURE;

DESIGN; ELECTROMAGNETIC PULSE; ELECTROMAGNETISM; ENERGY GAP; METAMATERIALS; PRINTED CIRCUIT BOARDS;

PRINTED CIRCUIT DESIGN;

EID: 79957864614     PISSN: 00189375     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEMC.2010.2051549     Document Type: Article

References (33)

1. J. Qin, O. M. Ramahi, and V. Granatstein, "Novel planar electromagnetic bandgap structures for mitigation of switching noise and EMI reduction in high-speed circuits," IEEE Trans. Electromagn. Compat., vol. 49, no. 3, pp. 661-669, Aug. 2007.
2. T. L. Wu, Y. H. Lin, T. K. Wang, C. C. Wang, and S. T. Chen, "Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits," IEEE Trans. Microw. Theory Tech., vol. 53, no. 9, pp. 2935-2942, Sep. 2005.
3. D. Chung, T. H. Kim, C. Ryu, E. Engin, M. Swaminathan, and J. Kim, "Effect of EBG structures for reducing noise in multi-layer PCBs for digital systems," in Proc. IEEE 15th Conf. Electr. Perform. Electron. Packag., Scottsdale, AZ, Oct. 23-25, 2006, pp. 253-256.
4. R. Chayono, M. Haneishi, and Y. Kimura, "Broadband CPW-fed circular MSA using planar electromagnetic band-gap structure," in Proc. Int. Workshop Antenna Technol.: Small Antennas Novel Metamaterials (iWAT 2008, Chiba, Japan, Mar. 4-6, pp. 462-465.
5. M. F. Abedin and M. Ali, "Reducing the mutual-coupling between the elements of a printed dipole array using planar EBG structures," in Proc. IEEE Antenna Propag. Soc. Int. Symp., Washington, DC, Jul. 3-8, 2005, pp. 598-601. (Pubitemid 46223009)
6. F. D. Paulis, A. Orlandi, L. Raimondo, and G. Antonini, "Fundamental mechanisms of coupling between planar electromagnetic bandgap structures and interconnects in high-speed digital circuits. Part I -Microstrip lines," presented at the EMC Eur.Workshop, Athens, Greece, Jun. 11-12, 2009.
7. S. Shahparnia and O.M. Ramahi, "Miniaturized electromagnetic bandgap structures for broadband switching noise suppression in PCBs," Electron. Lett., vol. 41, no. 9, pp. 519-520, Apr. 2005. (Pubitemid 40672620)
8. B.Mohajer-Iravani andO.M.Ramahi,"Wideband circuit model for planar EBG structures," IEEE Trans. Adv. Packag., vol. 33, no. 2, pp. 345-354, May 2010.
9. Y. Toyota, A. E. Engin, T. H. Kim, M. Swaminathan, and S. Bhattacharya, "Size reduction of electromagnetic bandgap (EBG) structures with new geometries and materials," presented at the IEEE 56th Electronic Component and Technology Conf., San Diego, CA, Jun. 2006.
10. T. L. Wu, C. C. Wang, Y. H. Lin, T. K. Wang, and G. Chang, "A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits," IEEE Microw.Wireless Compon. Lett., vol. 15, no. 3, pp. 174-176, Mar. 2005. (Pubitemid 40421606)
11. F. D. Paulis, A. Orlandi, L. Raimondo, B. Archambeault, and S. Connor, "Common mode filtering performances of planar EBG structures," presented at the IEEE Symp. Electromagnetic Compatibility, Austin, TX, Aug. 17-21 2009.
12. F. D. Paulis and A. Orlandi, "Signal integrity analysis of single-ended and differential striplines in presence of EBG planar structures," IEEE Microw. Wireless Compon. Lett., vol. 19, no. 9, pp. 554-557, Sep. 2009.
13. S. Huh, M. Swaminathan, and F. Muradali, "Design, modeling, and characterization of embedded electromagnetic band gap (EBG) structure," presented at the IEEE 17th Conf. Electrical Performance of Electronic Packaging, San Jose, CA, Oct. 27-29 2008.
14. F. D. Paulis, L. Raimondo, and A. Orlandi, "Incorporating embedded planar electromagnetic band-gap structures within multilayer printed circuit boards," IEEE Trans. Microw. Theory Tech., vol. 58, no. 7, pp. 878-887, Jul. 2010.
15. F. D. Paulis, L. Raimondo, and A. Orlandi, "IR-DROP Analysis and Thermal Assessment of PlanarElectromagnetic Bandgap Structures for Power Integrity Applications," IEEE Trans. on Adv. Packag., vol. 33, no. 3, pp. 410-418, Aug. 2010.
16. M. Ipuz, Z. A. Hil, and K. U. Lone, "Best practices for frequency characterization of printed circuit boards," Rep. 10, Cytec AG, Germany, 2001.
17. M. Bozzi, S. Germani, L. Minelli, L. Pellegrini, and P. D. Maagt, "Fullwave Characterization of Planar EBG Structures by the MoM/BI-RME Method," in Proc. IEEE Antenna Propag. Soc. Int. Symp., Monterey, CA, Jun. 20-25, 2004, pp. 4056-4059.
18. Y. Toyota, E. Engin, T. Kim, M. Swaminathan, and K. Uriu, "Stopband predictionwith dispersion diagram for electromagnetic bandgap structures in printed circuit boards," in Proc. IEEE EMC Symp., Portland, OR, Aug. 2006, pp. 807-811. (Pubitemid 46532698)
19. K. H. Kim and J. E. Schutt-Aińe, "Analysis and modeling of hybrid planartype electromagnetic-bandgap structures and feasibility study on power distribution network applications," IEEE Trans. Microw. Theory Tech., vol. 56, no. 1, pp. 178-186, Jan. 2008.
20. T. H. Kim, D. Chung, E. Engin,W. Yun, Y. Toyota, and M. Swaminathan, "A novel synthesismethod for designing electromagnetic band gap (EBG) structures in packaged mixed signal systems," in Proc. 56th Electron. Compon. Technol. Conf., San Diego, CA,May 30-Jun. 2, 2006, pp. 1645-1651. (Pubitemid 44929902)
21. T. Weiland, M. Timm, and I. Munteanu, "A practical guide to 3-D simulation," IEEE Microw. Mag., vol. 9, no. 6, pp. 62-75, Dec. 2008.
22. Computer Simulation Technology. (2009). CST Studio Suite [Online]. Available: http://www.cst.com/
23. A. P. Duffy, A. J. M. Martin, A. Orlandi, G. Antonini, T. M. Benson, and M. S. Woolfson, "Feature selective validation (FSV) for validation of computational electromagnetic (CEM). Part I-The FSV method," IEEE Trans. Electromagn. Compat., vol. 48, no. 3, pp. 449-459, Aug. 2006.
24. A. Orlandi, A. P. Duffy, B. Archambeault, G. Antonini, D. E. Coleby, and S. Connor, "Feature selective validation (FSV) for validation of computational electromagnetics (CEM). Part II-Assessment of FSV performance," IEEE Trans. Electromagn. Compat., vol. 48, no. 3, pp. 460-467, Aug. 2006. (Pubitemid 46405210)
25. A. Orlandi, Feature Selective Validation (FSV) Tool. (2008). [Online]. Available: http://uaqemc.ing.univaq.it/uaqemc/FSV-Tool/
26. A. Duffy. (2008). Feature Selective Validation Technique, official webpage, [Online]. Available: http://www.eng.cse.dmu.ac.uk/FSVweb/
27. Standard for Validation of Computational Elecromagnetics Computer Modeling and Simulation -Part 1, IEEE Standard P1597, 2008.
28. M. Swaminathan and A. E. Engin, Power Integrity Modeling and Design for Semiconductors and Systems. Englewood Cliffs, NJ: Prentice-Hall, 2007.
29. D. M. Pozar, Microwave Engineering, 3rd ed. New York: Wiley, 2005.
30. R. P. Clayton, Inductance-Loop and Partial. New York: Wiley, 2010.
31. R. P. Clayton, Analysis of Multiconductor Transmission Lines, 2nd ed. New York: Wiley, 2008.
32. N. Sankaran, S. Huh, M. Swaminathan, and R. Tummala, "Suppression of vertical coupling using electromagnetic band gap structures," in Proc. IEEE 17th Conf. Electr. Perform. Electron. Packag., San Jose, CA, Oct. 27-29,2008, pp. 173-176.
33. F. D. Paulis, L. Raimondo, and A. Orlandi, "Incorporating embedded planar electromagnetic band-gap structures within multilayer printed circuit boards," IEEE Trans. Microw. Theory Tech., vol. 58, no. 7, pp. 878-887, Jul. 2010.