Novel planar electromagnetic bandgap structures for mitigation of switching noise and EMI reduction in high-speed circuits

IEEE Transactions on Electromagnetic Compatibility

Volumn 49, Issue 3, 2007, Pages 661-669

  Qin, Jie ^a   Ramahi, Omar M ^b   Granatstein, Victor ^a  

^a UNIVERSITY OF MARYLAND   (United States)

^b UNIVERSITY OF WATERLOO   (Canada)

Author keywords

Electromagnetic bandgap (EBG); Electromagnetic interference (EMI); Signal integrity (SI); Simultaneous switching noise (SSN)

Indexed keywords

BAND GAPS; EBG STRUCTURES; ELECTROMAGNETIC BAND-GAP STRUCTURES; ELECTROMAGNETIC BANDGAP (EBG); ELECTROMAGNETIC INTERFERENCE (EMI); ELECTROMAGNETIC INTERFERENCE REDUCTIONS; FEED POINTS; FIELD INTENSITIES; HIGH-SPEED; HIGH-SPEED CIRCUITS; LEAKAGE FIELDS; LEAKAGE RADIATIONS; NOVEL CONCEPTS; PATTERNED STRUCTURES; POWER PLANES; SIGNAL INTEGRITY (SI); SIMULATION AND MEASUREMENTS; SIMULTANEOUS SWITCHING NOISE (SSN); SUPER CELLS; SWITCHING NOISE; ULTRA WIDES;

ELECTROMAGNETIC COMPATIBILITY; ELECTROMAGNETIC PULSE; ELECTROMAGNETIC WAVE INTERFERENCE; ELECTROMAGNETISM; ENERGY GAP; JITTER; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; QUALITY ASSURANCE; SANITARY SEWERS; SWITCHING;

MAGNETIC MATERIALS;

EID: 47649083558     PISSN: 00189375     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEMC.2007.902193     Document Type: Article

References (27)

1. L. D. Smith, "Simultaneous switching noise and power plane bounce for CMOS technology," in Proc. IEEE 8th Top. Meet. Electr. Perform. Electron. Packag., San Deigo, CA, Oct. 1999, pp. 163-166.
2. R. Senthinatan and J. Price, Simultaneous Switching Noise of CMOS Devices and Systems. Norwell, MA: Kluwer, 1994.
3. V. Ricchiuti, "Power-supply decoupling on fully populated high-speed digital PCBs," IEEE Trans. Electromagn. Compat., vol. 43, no. 4, pp. 671-676, Nov. 2001.
4. M. Xu, T. H. Hubing, J. Chen, T. P. Van Doren, J. L. Drewniak, and R. E. DuBroff, "Power-bus decoupling with embedded capacitance in printed circuit board design," IEEE Trans. Electromagn. Compat., vol. 45, no. 1, pp. 22-30, Feb. 2003.
5. D. F. Sievenpiper, L. Zhang, R. F. J. Broag, N. G. Alexopolous, and E. Yablonovitch, "High-impedance electromagnetic surfaces with a forbidden frequency band," IEEE Trans. Microw. Theory Tech., vol. 47, no. 11, pp. 2059-2073, Nov. 1999.
6. D. F. Sievenpiper, "High-impedance electromagnetic surfaces" Ph.D. dissertation, Dept. Elect. Eng, Univ. California Los Angeles, Los Angeles, CA, 1999.
7. R. Abhari and G. V. Eleftheriades, "Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits," IEEE Trans. Microw. Theory Tech., vol. 51, no. 6, pp. 1629-1639, Jun. 2003.
8. T. Kamgaing and O. M. Ramahi, "A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface," IEEE Microw. Wireless Compon. Lett., vol. 13, no. 1, pp. 21-23, Jan. 2003.
9. S. Shahparnia and O.M. Ramahi, "Miniaturized electromagnetic bandgap structures for broadband switching noise suppression in PCBs," Electron. Lett., vol. 41, no. 9, pp. 519-520, Apr. 2005.
10. T. Kamgaing and O. M. Ramahi, "Inductance-enhanced high-impedance surfaces for broad-band simultaneous switching noise mitigation in power planes," in IEEE MTT-S Int. Microw. Symp. Dig., vol. 3, pp. 2165-2168, Jun. 2003.
11. S. D. Rogers, "Electromagnetic-bandgap layers for broad-band suppression of TEM modes in power planes," IEEE Trans.Microw. Theory Tech., vol. 53, no. 8, pp. 2495-2505, Aug. 2005.
12. S. Shahparnia, B. Mohajer-Iravani, and O. M. Ramahi, "Electromagnetic noise mitigation in high-speed printed circuit boards and packaging using electromagnetic bandgap structures," in Proc. 54th Electron. Compon. Technol. Conf., Las Vegas, NV, Jun. 2004, pp. 1831-1836.
13. F. R. Yang, K. P. Ma, and T. Itoh, "A uniplanar compact photonic-bandgap (UC-PBG) structure and its applications for microwave circuits," IEEE Trans. Microw. Theory Tech., vol. 47, no. 8, pp. 1509-1514, Aug. 1999.
14. T. L. Wu, C. C. Yang, Y. H. Lin et al., "A novel power plane with superwideband elimination of ground bounce noise on high speed circuits," IEEE Microw Wireless Compon. Lett., vol. 15, no. 3, pp. 174-176, Mar. 2005.
15. J. Qin and O. M. Ramahi, "Ultra-wideband mitigation of simultaneous switching noise using novel planar electromagnetic bandgap structure," IEEE Microw. Wireless Compon. Lett., vol. 16, no. 9, pp. 487-489, Sep. 2006.
16. J. Choi, V. Govind, M. Swaminathan, L. Wan, and R. Doraiswami, "Isolation in mixed-signal systems using a novel electromagnetic bandgap (EBG) structure," in Proc. IEEE 13th Top. Meet. Electr. Perform. Electron. Packag., Portland, OR, Oct. 2004, pp. 199-202.
17. T. L. Wu, Y. H. Lin, and S. T. Chen, "A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures," IEEE Microw. Wireless Compon. Lett. vol. 14, no. 7, pp. 337-339, Jul. 2004.
18. N. Shino and Z. Popovic, "Radiation from ground-plane photonic bandgap microstrip waveguide," IEEE MTT-S Int. Microw. Symp. Dig, vol. 2, pp. 1079-1082, Jun. 2002.
19. J. Lee, H. Kim, and J. Kim, "High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions," IEEE Microw. Wireless Compon. Lett., vol. 15, no. 8, pp. 505-507, Aug. 2005.
20. Y. Ko, K. Ito, J. Kudo, and T. Sudo, "Electromagnetic radiation properties of a printed circuit board with a slot in the ground plane," in Proc. Int. Symp. Electromagn. Compat., Tokyo, Japan, May 1999, pp. 576-579.
21. HFSS, High Frequency Structure Simulator version 9.2, Ansoft Corp. Pittsburgh, PA.
22. Jianming Jin, The Finite Elements in Electromagnetics. New York: Wiley, 2002.
23. T. H. Hubing, "Printed circuit board EMI source mechanisms," in Proc. IEEE Int. Symp. Electromagn. Compat., Boston, MA, Aug. vol. 1, 2003, pp. 1-3.
24. M. Leone, "The radiation of a rectangular power bus structure at multiple cavity-mode resonances," IEEE Trans. Electromagn. Compat. vol. 45, no. 3, pp. 486-492, Aug. 2003.
25. N. Na, J. Choi, S. Chun, M. Swaminathan, and J. Srinivasan, "Modeling and transient simulation of planes in electronic packages," IEEE Trans. Adv. Packag., vol. 23, no. 3, pp. 340-352, Aug. 2000.
26. P. Clayton, Introduction to Electromagnetic Compatibility. Hoboken, NJ: Wiley-Interscience, 1992.
27. J. C. W. Ho, Q. Zhu, and R. Abhari, "Modeling of transmission lines with textured ground planes and investigation of data transmission by generating eye diagrams," in Proc. IEEE 13th Top. Meet. Electr. Perform. Electron. Packag., Portland, OR, Oct. 2004, pp. 195-198.