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Volumn , Issue , 2008, Pages 173-176

2008 IEEE electrical performance of electronic packaging suppression of vertical coupling using electromagnetic band GAP structures

Author keywords

[No Author keywords available]

Indexed keywords

EBG STRUCTURES; ELECTRICAL PERFORMANCES; ELECTRONIC PACKAGING; NOISE COUPLINGS; SIMULATION AND MEASUREMENTS; STOP BANDS; VERTICAL COUPLINGS; VERTICAL DIRECTIONS;

EID: 58049120031     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2008.4675906     Document Type: Conference Paper
Times cited : (3)

References (6)
  • 1
    • 20444403734 scopus 로고    scopus 로고
    • Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs
    • May
    • Junwoo Lee; Rotaru, M.D.; Iyer, M.K.; Hyungsoo Kim; Joungho Kim, "Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs," Advanced Packaging, IEEE Transactions, vol.28, no.2, pp. 298-309, May 2005
    • (2005) Advanced Packaging, IEEE Transactions , vol.28 , Issue.2 , pp. 298-309
    • Lee, J.1    Rotaru, M.D.2    Iyer, M.K.3    Kim, H.4    Kim, J.5
  • 2
    • 51349150844 scopus 로고    scopus 로고
    • Sankaran, Nithya; Venkatesh Chelukka Ramdas,; Baik-Woo Lee,; Sundaram, Venky; Engin, Ege; Iyer, Mahadevan; Swaminathan, Madhavan; Tummala, Rao, Coupling noise analysis and high frequency design optimization of power/ground plane stack-up in Embedded chip substrate cavities, Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, no., pp. 1874-1879, 27-30 May 2008
    • Sankaran, Nithya; Venkatesh Chelukka Ramdas,; Baik-Woo Lee,; Sundaram, Venky; Engin, Ege; Iyer, Mahadevan; Swaminathan, Madhavan; Tummala, Rao, "Coupling noise analysis and high frequency design optimization of power/ground plane stack-up in Embedded chip substrate cavities," Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, vol., no., pp. 1874-1879, 27-30 May 2008
  • 3
    • 58049104274 scopus 로고    scopus 로고
    • O.M.Ramahi, S.Shahparnia, B.Mohajer-Irvani, Electromagnetic Bandgap material: Exotic stuff for not-so-exotic EMI/EMC Applications, Interference Technology, Annual EMC Guide 2004
    • O.M.Ramahi, S.Shahparnia, B.Mohajer-Irvani, "Electromagnetic Bandgap material: Exotic stuff for not-so-exotic EMI/EMC Applications", Interference Technology, Annual EMC Guide 2004
  • 4
    • 14844294779 scopus 로고    scopus 로고
    • A novel electromagnetic bandgap (EBG) structure for mixed-signal system Applications
    • Atlanta, GA, September
    • J. Choi, V. Govind, and M. Swaminathan, "A novel electromagnetic bandgap (EBG) structure for mixed-signal system Applications," 2004 IEEE Radio and Wireless Conference (RAWCON), pp.243-246, Atlanta, GA, September 2004
    • (2004) 2004 IEEE Radio and Wireless Conference (RAWCON) , pp. 243-246
    • Choi, J.1    Govind, V.2    Swaminathan, M.3
  • 5
    • 58049112185 scopus 로고    scopus 로고
    • Design, Modeling, and Characterization of Multi-Layered Electromagnetic Band Gap (EBG) Structure, Submitted for 2008 IEEE
    • Suzanne Huh and M. Swaminathan, "Design, Modeling, and Characterization of Multi-Layered Electromagnetic Band Gap (EBG) Structure", Submitted for 2008 IEEE Electrical Performance of Electronic Packaging
    • Electrical Performance of Electronic Packaging
    • Huh, S.1    Swaminathan, M.2
  • 6
    • 50049096031 scopus 로고    scopus 로고
    • Switching Noise Suppression in Mixed Signal System Applications Using Electromagnetic Band Gap (EBG) Synthesizer
    • Oct
    • T.H. Kim, E.Engin, M. Swaminathan, "Switching Noise Suppression in Mixed Signal System Applications Using Electromagnetic Band Gap (EBG) Synthesizer," Electrical Performance of Electronic Packaging, Oct. 2006
    • (2006) Electrical Performance of Electronic Packaging
    • Kim, T.H.1    Engin, E.2    Swaminathan, M.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.