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1
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20444403734
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Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs
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May
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Junwoo Lee; Rotaru, M.D.; Iyer, M.K.; Hyungsoo Kim; Joungho Kim, "Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs," Advanced Packaging, IEEE Transactions, vol.28, no.2, pp. 298-309, May 2005
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Advanced Packaging, IEEE Transactions
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Lee, J.1
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Kim, H.4
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2
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51349150844
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Sankaran, Nithya; Venkatesh Chelukka Ramdas,; Baik-Woo Lee,; Sundaram, Venky; Engin, Ege; Iyer, Mahadevan; Swaminathan, Madhavan; Tummala, Rao, Coupling noise analysis and high frequency design optimization of power/ground plane stack-up in Embedded chip substrate cavities, Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, no., pp. 1874-1879, 27-30 May 2008
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Sankaran, Nithya; Venkatesh Chelukka Ramdas,; Baik-Woo Lee,; Sundaram, Venky; Engin, Ege; Iyer, Mahadevan; Swaminathan, Madhavan; Tummala, Rao, "Coupling noise analysis and high frequency design optimization of power/ground plane stack-up in Embedded chip substrate cavities," Electronic Components and Technology Conference, 2008. ECTC 2008. 58th, vol., no., pp. 1874-1879, 27-30 May 2008
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3
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58049104274
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O.M.Ramahi, S.Shahparnia, B.Mohajer-Irvani, Electromagnetic Bandgap material: Exotic stuff for not-so-exotic EMI/EMC Applications, Interference Technology, Annual EMC Guide 2004
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O.M.Ramahi, S.Shahparnia, B.Mohajer-Irvani, "Electromagnetic Bandgap material: Exotic stuff for not-so-exotic EMI/EMC Applications", Interference Technology, Annual EMC Guide 2004
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4
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14844294779
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A novel electromagnetic bandgap (EBG) structure for mixed-signal system Applications
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Atlanta, GA, September
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J. Choi, V. Govind, and M. Swaminathan, "A novel electromagnetic bandgap (EBG) structure for mixed-signal system Applications," 2004 IEEE Radio and Wireless Conference (RAWCON), pp.243-246, Atlanta, GA, September 2004
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2004 IEEE Radio and Wireless Conference (RAWCON)
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Choi, J.1
Govind, V.2
Swaminathan, M.3
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5
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58049112185
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Design, Modeling, and Characterization of Multi-Layered Electromagnetic Band Gap (EBG) Structure, Submitted for 2008 IEEE
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Suzanne Huh and M. Swaminathan, "Design, Modeling, and Characterization of Multi-Layered Electromagnetic Band Gap (EBG) Structure", Submitted for 2008 IEEE Electrical Performance of Electronic Packaging
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Electrical Performance of Electronic Packaging
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Huh, S.1
Swaminathan, M.2
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6
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50049096031
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Switching Noise Suppression in Mixed Signal System Applications Using Electromagnetic Band Gap (EBG) Synthesizer
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Oct
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T.H. Kim, E.Engin, M. Swaminathan, "Switching Noise Suppression in Mixed Signal System Applications Using Electromagnetic Band Gap (EBG) Synthesizer," Electrical Performance of Electronic Packaging, Oct. 2006
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(2006)
Electrical Performance of Electronic Packaging
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Kim, T.H.1
Engin, E.2
Swaminathan, M.3
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