Nanometric cutting of single crystal silicon surfaces modified by ion implantation

CIRP Annals - Manufacturing Technology

Volumn 60, Issue 1, 2011, Pages 527-530

  Fang, F Z ^a   Chen, Y H ^a   Zhang, X D ^a   Hu, X T ^a   Zhang, G X ^a  

^a TIANJIN UNIVERSITY   (China)

Author keywords

Cutting; Ion implantation; Silicon

Indexed keywords

ASPHERIC SURFACES; CUTTING PROCESS; MACHINING EFFICIENCY; MATERIAL'S SURFACE; MOLECULAR DYNAMICS SIMULATIONS; NANOMETRIC CUTTING; NOVEL METHODS; SILICON SURFACES; SINGLE CRYSTAL SILICON; SURFACE FRACTURE; SURFACE MODIFICATION; TOOL LIFE;

ION IMPLANTATION; IONS; MECHANICAL PROPERTIES; MOLECULAR DYNAMICS; RAMAN SPECTROSCOPY; SILICON WAFERS; SINGLE CRYSTAL SURFACES; SINGLE CRYSTALS; SURFACES; TRANSMISSION ELECTRON MICROSCOPY;

CRYSTAL CUTTING;

EID: 79957651431     PISSN: 00078506     EISSN: 17260604     Source Type: Journal    
DOI: 10.1016/j.cirp.2011.03.057     Document Type: Article

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