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Volumn 59, Issue 10, 2011, Pages 4043-4054
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In situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni
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Author keywords
Eutectic solidification; Intermetallic compounds; Soldering; Synchrotron radiation
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Indexed keywords
BINARY EUTECTICS;
COMPOSITION MEASUREMENTS;
EUTECTIC GROOVE;
EUTECTIC SOLIDIFICATION;
FREEZING RANGE;
IN-SITU;
INTERFACE CURVATURES;
INTERMETALLIC COMPOUNDS;
PB FREE SOLDERS;
PHASE COMPETITION;
POST MORTEM;
SYNCHROTRON X-RAY RADIOGRAPHY;
UNIDIRECTIONAL SOLIDIFICATION;
EUTECTICS;
INTERMETALLICS;
LEAD;
PHASE INTERFACES;
RADIOLOGY;
SCANNING ELECTRON MICROSCOPY;
SOLDERING;
SOLDERING ALLOYS;
SYNCHROTRON RADIATION;
SYNCHROTRONS;
TIN;
X RAY RADIOGRAPHY;
SOLIDIFICATION;
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EID: 79955551915
PISSN: 13596454
EISSN: None
Source Type: Journal
DOI: 10.1016/j.actamat.2011.03.028 Document Type: Article |
Times cited : (57)
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References (40)
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