Interfacial reaction and mechanical property of BGA solder joints with LTCC substrate

Journal of Korean Institute of Metals and Materials

Volumn 47, Issue 3, 2009, Pages 202-208

  Yoo, Choong Sik ^a,b   Ha, Sang Su ^b   Kim, Bae Kyun ^a   Jang, Jin Kyu ^b   Seo, Won Chan ^c   Jung, Seung Boo ^b  

^a Samsung Electro Mechanics   (South Korea)

^b Sungkyunkwan University   (South Korea)

^c Pukyong National University   (South Korea)

Author keywords

Finite element modeling (FEM); Interfacial reaction; Intermetallic compound (IMC); Low temperature co fired ceramic (LTCC); Shear strength

Indexed keywords

EID: 64549140606     PISSN: 17388228     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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